Kuppusamy Kanakarajan

Person

Dublin, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Colorless transparent copolyamide-imide films with high modulus and...
- Patent number 11,827,749
- Issue date Nov 28, 2023
- RAYITEK Hi-Tech Film Company, Ltd., Shenzhen
- Karthikeyan Perumal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Colored polyimide films and methods relating thereto
- Patent number 9,303,136
- Issue date Apr 5, 2016
- E. I. Du Pont de Nemours and Company
- Christopher Robert Becks
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer article for flexible printed circuits
- Patent number 8,440,292
- Issue date May 14, 2013
- E I du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aramid filled polyimides having advantageous thermal expansion prop...
- Patent number 8,124,223
- Issue date Feb 28, 2012
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aramid filled polyimides having advantageous thermal expansion prop...
- Patent number 7,790,276
- Issue date Sep 7, 2010
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide composite coverlays and methods and compositions relating...
- Patent number 7,579,134
- Issue date Aug 25, 2009
- E. I. DuPont de Nemours and Company
- Thomas Eugene Dueber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature curable photosensitive compositions
- Patent number 7,524,617
- Issue date Apr 28, 2009
- E. I. Du Pont de Nemours and Company
- Thomas E. Dueber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature curable photosensitive compositions
- Patent number 7,476,489
- Issue date Jan 13, 2009
- E.I. DuPont de Nemours
- Thomas E. Dueber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature polyimide adhesive compositions and methods relatin...
- Patent number 7,348,064
- Issue date Mar 25, 2008
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low temperature polyimide adhesive compositions and methods relatin...
- Patent number 7,348,080
- Issue date Mar 25, 2008
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low temperature cure polyimide compositions resistant to arc tracki...
- Patent number 7,338,715
- Issue date Mar 4, 2008
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low temperature polyimide adhesive compositions and methods relatin...
- Patent number 7,026,436
- Issue date Apr 11, 2006
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flexible multi-layer polyimide film laminates and preparation thereof
- Patent number 5,411,765
- Issue date May 2, 1995
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible multi-layer polyimide film laminates and preparation thereof
- Patent number 5,298,331
- Issue date Mar 29, 1994
- E. I. Du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
COLORLESS TRANSPARENT COPOLYAMIDE-IMIDE FILMS WITH HIGH MODULUS AND...
- Publication number 20210309804
- Publication date Oct 7, 2021
- Goldengate Quantum Technology Co. Ltd.
- Karthikeyan PERUMAL
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO
- Publication number 20140103265
- Publication date Apr 17, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- Christopher Becks
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO
- Publication number 20140093714
- Publication date Apr 3, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- Christopher Robert Becks
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ARAMID FILLED POLYIMIDES HAVING ADVANTAGEOUS THERMAL EXPANSION PROP...
- Publication number 20100311901
- Publication date Dec 9, 2010
- E.I. du Pont de Nemours and Company
- KUPPUSAMY KANAKARAJAN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER ARTICLE FOR FLEXIBLE PRINTED CIRCUITS
- Publication number 20100291371
- Publication date Nov 18, 2010
- E.I. du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER INSULATION FOR WIRE, CABLE OR OTHER CONDUCTIVE MATERIALS
- Publication number 20090297858
- Publication date Dec 3, 2009
- E.I. du Pont de Nemours and Company
- DANNY E. GLENN
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE STRUCTURES FOR HIGH TEMPERATURE PHOTOVOLTAIC APPLICATIONS,...
- Publication number 20090288699
- Publication date Nov 26, 2009
- E.I. du Pont de Nemours and Company
- Brian C. Auman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH F...
- Publication number 20090242823
- Publication date Oct 1, 2009
- Karthikeyan Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATES FOR PRINTED...
- Publication number 20090142567
- Publication date Jun 4, 2009
- E.I. du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- B32 - LAYERED PRODUCTS
Information Patent Application
MULTI-LAYER LAMINATE SUBSTRATES USEFUL IN ELECTRONIC TYPE APPLICATIONS
- Publication number 20090025867
- Publication date Jan 29, 2009
- E. I. du Pont de Nemours and Company
- Kuppusamy Kanakarajan
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layer laminate substrates useful in electronic type applications
- Publication number 20070298260
- Publication date Dec 27, 2007
- Kuppusamy Kanakarajan
- B32 - LAYERED PRODUCTS
Information Patent Application
Polyimide based compositions useful in high frequency circuitry app...
- Publication number 20070232734
- Publication date Oct 4, 2007
- Karthikeyan Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Aramid filled polyimides having advantageous thermal expansion prop...
- Publication number 20070231568
- Publication date Oct 4, 2007
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Capacitive polyimide laminate
- Publication number 20070231588
- Publication date Oct 4, 2007
- Karthikeyan Kanakarajan
- B32 - LAYERED PRODUCTS
Information Patent Application
Low temperature polyimide adhesive compositions and methods relatin...
- Publication number 20060068210
- Publication date Mar 30, 2006
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low temperature polyimide adhesive compositions and methods relatin...
- Publication number 20060068211
- Publication date Mar 30, 2006
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low temperature polyimide adhesive compositions and methods relatin...
- Publication number 20040099374
- Publication date May 27, 2004
- Kuppusamy Kanakarajan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kuppusamy Kanakarajan

Person

Patents Grantslast 30 patents

Colorless transparent copolyamide-imide films with high modulus and...

Colored polyimide films and methods relating thereto

Multi-layer article for flexible printed circuits

Aramid filled polyimides having advantageous thermal expansion prop...

Aramid filled polyimides having advantageous thermal expansion prop...

Polyimide composite coverlays and methods and compositions relating...

Low-temperature curable photosensitive compositions

Low-temperature curable photosensitive compositions

Low temperature polyimide adhesive compositions and methods relatin...

Low temperature polyimide adhesive compositions and methods relatin...

Low temperature cure polyimide compositions resistant to arc tracki...

Low temperature polyimide adhesive compositions and methods relatin...

Flexible multi-layer polyimide film laminates and preparation thereof

Flexible multi-layer polyimide film laminates and preparation thereof

Patents Applicationslast 30 patents

COLORLESS TRANSPARENT COPOLYAMIDE-IMIDE FILMS WITH HIGH MODULUS AND...

COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO

COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO

ARAMID FILLED POLYIMIDES HAVING ADVANTAGEOUS THERMAL EXPANSION PROP...

MULTI-LAYER ARTICLE FOR FLEXIBLE PRINTED CIRCUITS

MULTILAYER INSULATION FOR WIRE, CABLE OR OTHER CONDUCTIVE MATERIALS

LAMINATE STRUCTURES FOR HIGH TEMPERATURE PHOTOVOLTAIC APPLICATIONS,...

PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH F...

THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATES FOR PRINTED...

MULTI-LAYER LAMINATE SUBSTRATES USEFUL IN ELECTRONIC TYPE APPLICATIONS

Multi-layer laminate substrates useful in electronic type applications

Polyimide based compositions useful in high frequency circuitry app...

Aramid filled polyimides having advantageous thermal expansion prop...

Capacitive polyimide laminate

Low temperature polyimide adhesive compositions and methods relatin...

Low temperature polyimide adhesive compositions and methods relatin...

Low temperature polyimide adhesive compositions and methods relatin...