Kurashima Yohei

Person

Suwa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,608,371
- Issue date Aug 19, 2003
- Seiko Epson Corporation
- Yohei Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding using brazing material
- Patent number 6,158,648
- Issue date Dec 12, 2000
- Seiko Epson Corporation
- Yoshiaki Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding using brazing material
- Patent number 6,100,496
- Issue date Aug 8, 2000
- Seiko Epson Corporation
- Miyakawa Takuya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding using brazing material at approxim...
- Patent number 5,831,238
- Issue date Nov 3, 1998
- Seiko Epson Corporation
- Miyakawa Takuya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding using brazing material
- Patent number 5,735,451
- Issue date Apr 7, 1998
- Seiko Epson Corporation
- Yoshiaki Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20020017710
- Publication date Feb 14, 2002
- SEIKO EPSON CORPORATION
- Yohei Kurashima
- H01 - BASIC ELECTRIC ELEMENTS

Kurashima Yohei

Person

Patents Grantslast 30 patents

Wiring board and fabricating method thereof, semiconductor device a...

Semiconductor device and method of manufacturing the same, circuit...

Wiring board and fabricating method thereof, semiconductor device a...

Method and apparatus for bonding using brazing material

Method and apparatus for bonding using brazing material

Method and apparatus for bonding using brazing material at approxim...

Method and apparatus for bonding using brazing material

Patents Applicationslast 30 patents

Wiring board and fabricating method thereof, semiconductor device a...

Wiring board and fabricating method thereof, semiconductor device a...

Semiconductor device and method of manufacturing the same, circuit...