Kurt E. SINCERBOX

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal chip carrier and method
- Patent number 8,650,748
- Issue date Feb 18, 2014
- National Semiconductor Corporation
- Artur Darbinyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
- Publication number 20250140653
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL OUTLINE TRANSISTOR WITH THERMAL FLAT LEAD
- Publication number 20240055331
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
- Publication number 20230005880
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FLIP CHIP PACKAGE WITH EXPOSED CLIP
- Publication number 20200235067
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CHIP CARRIER AND METHOD
- Publication number 20120285730
- Publication date Nov 15, 2012
- National Semiconductor Corporation
- Artur DARBINYAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE FOR SYSTEM LEVEL ELECTRONIC PRODUCTS
- Publication number 20120057313
- Publication date Mar 8, 2012
- National Semiconductor Corporation
- Artur DARBINYAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR