Kurt GEHRIG

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Altdorf, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,984,927
- Issue date May 29, 2018
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,196,535
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Mathias Vaupel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20170117183
- Publication date Apr 27, 2017
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS