Kurt Hingerl

Person

Wolfern, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for bonding substrates
- Patent number 11,862,466
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts
- Patent number 11,694,977
- Issue date Jul 4, 2023
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding substrates
- Patent number 10,971,365
- Issue date Apr 6, 2021
- EV Group E. Thallner GmbH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 9,252,042
- Issue date Feb 2, 2016
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 9,159,717
- Issue date Oct 13, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 8,975,158
- Issue date Mar 10, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20210202251
- Publication date Jul 1, 2021
- EV GROUP E. THALLNER GMBH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Between Component Parts
- Publication number 20210035934
- Publication date Feb 4, 2021
- OSRAM Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR BONDING SUBSTRATES
- Publication number 20190393037
- Publication date Dec 26, 2019
- EV GROUP E. THALLNER GMBH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS
- Publication number 20150165752
- Publication date Jun 18, 2015
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140073112
- Publication date Mar 13, 2014
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140051231
- Publication date Feb 20, 2014
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140017877
- Publication date Jan 16, 2014
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20130299080
- Publication date Nov 14, 2013
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Kurt Hingerl

Person

Patents Grantslast 30 patents

Method and device for bonding substrates

Method for producing a connection between component parts

Method and device for bonding substrates

Method for permanently bonding wafers

Method for permanently bonding wafers by a connecting layer by mean...

Method for permanent bonding of wafers

Method for permanent bonding of wafers

Method for permanently bonding wafers

Method for permanently bonding wafers

Patents Applicationslast 30 patents

METHOD AND DEVICE FOR BONDING SUBSTRATES

Method for Producing a Connection Between Component Parts

METHOD AND DEVICE FOR BONDING SUBSTRATES

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENT BONDING OF WAFERS