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Kurt J. Bossart
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Eagle, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
Patent number
11,402,426
Issue date
Aug 2, 2022
Micron Technology, Inc.
Tony M. Lindenberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
Patent number
11,094,684
Issue date
Aug 17, 2021
Micron Technology, Inc.
Chandra S. Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
Patent number
10,852,344
Issue date
Dec 1, 2020
Micron Technology, Inc.
Tony M. Lindenberg
G01 - MEASURING TESTING
Information
Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
Patent number
10,403,618
Issue date
Sep 3, 2019
Micron Technology, Inc.
Chandra S. Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming semiconductor devices including determining misr...
Patent number
9,754,895
Issue date
Sep 5, 2017
Micron Technology, Inc.
Yang Chao
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
Publication number
20210041495
Publication date
Feb 11, 2021
Micron Technology, Inc.
Tony M. Lindenberg
G01 - MEASURING TESTING
Information
Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
Publication number
20190341378
Publication date
Nov 7, 2019
Micron Technology, Inc.
Chandra S. Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
Publication number
20190178933
Publication date
Jun 13, 2019
Micron Technology, Inc.
Tony M. Lindenberg
G01 - MEASURING TESTING
Information
Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
Publication number
20190088637
Publication date
Mar 21, 2019
Micron Technology, Inc.
Chandra S. Tiwari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING DETERMINING MISR...
Publication number
20170256501
Publication date
Sep 7, 2017
Micron Technology, Inc.
Yang Chao
G06 - COMPUTING CALCULATING COUNTING