Kurt Raab

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for temporary bussing of semiconductor package substrates
- Patent number 9,449,890
- Issue date Sep 20, 2016
- Amkor Technology, Inc.
- Johnnie Quan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing flexible tape for microelectronic assemblies
- Patent number 6,687,980
- Issue date Feb 10, 2004
- Tessera, Inc.
- Joseph Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferable resilient element for packaging of a semiconductor chi...
- Patent number 6,686,015
- Issue date Feb 3, 2004
- Tessera, Inc.
- Kurt Raab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with frangible lead sections
- Patent number 6,309,910
- Issue date Oct 30, 2001
- Tessera Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making compliant interfaces and microelectronic packages...
- Patent number 6,300,254
- Issue date Oct 9, 2001
- Tessera, Inc.
- Kurt Raab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferable resilient element for packaging of a semiconductor chi...
- Patent number 6,294,040
- Issue date Sep 25, 2001
- Tessera, Inc.
- Kurt Raab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal unit strip/carrier frame assembly and methods
- Patent number 6,170,151
- Issue date Jan 9, 2001
- Tessera, Inc.
- Joseph Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal unit strip/carrier frame assembly and methods
- Patent number 6,049,972
- Issue date Apr 18, 2000
- Tessera, Inc.
- Joseph Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple part compliant interface for packaging of a semiconductor...
- Patent number 5,915,170
- Issue date Jun 22, 1999
- Tessera, Inc.
- Kurt Raab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer tab tape having distinct signal, power and ground plane...
- Patent number 5,854,085
- Issue date Dec 29, 1998
- LSI Logic Corporation
- Kurt Raymond Raab
- G01 - MEASURING TESTING
Information Patent Grant
Electronic system using multi-layer tab tape semiconductor device h...
- Patent number 5,801,432
- Issue date Sep 1, 1998
- LSI Logic Corporation
- Michael D. Rostoker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Transferable resilient element for packaging of a semiconductor chi...
- Publication number 20020007904
- Publication date Jan 24, 2002
- Kurt Raab
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods for temporary bussing of semiconductor package substrates

Apparatus for processing flexible tape for microelectronic assemblies

Transferable resilient element for packaging of a semiconductor chi...

Microelectronic components with frangible lead sections

Methods of making compliant interfaces and microelectronic packages...

Transferable resilient element for packaging of a semiconductor chi...

Universal unit strip/carrier frame assembly and methods

Universal unit strip/carrier frame assembly and methods

Multiple part compliant interface for packaging of a semiconductor...

Multi-layer tab tape having distinct signal, power and ground plane...

Electronic system using multi-layer tab tape semiconductor device h...

Patents Applicationslast 30 patents

Transferable resilient element for packaging of a semiconductor chi...