Kurt Schultz

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Banks, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Composite photoresist for modifying die-side bumps
- Patent number 7,585,615
- Issue date Sep 8, 2009
- Intel Corporation
- Kurt Schultz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RISERS INCLUDING A PLURALITY OF HIGH ASPECT RATIO ELECTRICAL CONDUI...
- Publication number 20130069680
- Publication date Mar 21, 2013
- Cascade Microtech, Inc.
- Koby L. Duckworth
- G01 - MEASURING TESTING
Information Patent Application
Composite photoresist for modifying die-side bumps
- Publication number 20080026318
- Publication date Jan 31, 2008
- Kurt Schultz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Tapered die-side bumps
- Publication number 20080003715
- Publication date Jan 3, 2008
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS