Kwang H. Chu

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low contact force, dual fraction particulate interconnect
- Patent number 6,574,114
- Issue date Jun 3, 2003
- 3M Innovative Properties Company
- Steven R. Brindle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cable closure injection sealed with organo borane amine complex
- Patent number 6,284,976
- Issue date Sep 4, 2001
- 3M Innovative Properties Company
- Jacqueline J. Pulido
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cable closure injection sealed with organoborane amine complex
- Patent number 6,064,006
- Issue date May 16, 2000
- 3M Innovative Properties Company
- Jacqueline J. Pulido
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Susceptor composite material patterned in neat polymer
- Patent number 6,048,599
- Issue date Apr 11, 2000
- 3M Innovative Properties Company
- Kwang H. Chu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Cable closure injection sealed with low surface energy adhesive
- Patent number 5,912,433
- Issue date Jun 15, 1999
- Minnesota Mining and Manufacturing Company
- Jacqueline J. Pulido
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical termination and method for making same
- Patent number 5,313,702
- Issue date May 24, 1994
- Thomas & Betts Corporation
- Adam Fischer
- H01 - BASIC ELECTRIC ELEMENTS

Kwang H. Chu

Person

Patents Grantslast 30 patents

Low contact force, dual fraction particulate interconnect

Cable closure injection sealed with organo borane amine complex

Cable closure injection sealed with organoborane amine complex

Susceptor composite material patterned in neat polymer

Cable closure injection sealed with low surface energy adhesive

Electrical termination and method for making same