Kwang Hee KWON

Person

Busan, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil electronic component and method of manufacturing the same
- Patent number 10,636,562
- Issue date Apr 28, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component and method of manufacturing the same
- Patent number 10,515,755
- Issue date Dec 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component and method of manufacturing the same
- Patent number 10,395,814
- Issue date Aug 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220408559
- Publication date Dec 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Joon CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190333683
- Publication date Oct 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180122555
- Publication date May 3, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180122557
- Publication date May 3, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180122556
- Publication date May 3, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ki Seok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160338211
- Publication date Nov 17, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Won HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20160105956
- Publication date Apr 14, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150366059
- Publication date Dec 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20150351231
- Publication date Dec 3, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Kwan LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150351247
- Publication date Dec 3, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Hee KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kwang Hee KWON

Person

Patents Grantslast 30 patents

Printed circuit board

Coil electronic component and method of manufacturing the same

Coil electronic component and method of manufacturing the same

Coil electronic component and method of manufacturing the same

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME