Kwang Seop Youm

Person

Yeongi, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and manufacturing method thereof, and semicon...
- Patent number 10,342,135
- Issue date Jul 2, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ryul Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip-embedded printed circuit board and semiconductor package using...
- Patent number 9,392,698
- Issue date Jul 12, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Chang Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate strip
- Patent number 9,318,356
- Issue date Apr 19, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joong Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board strip and panel
- Patent number 8,253,032
- Issue date Aug 28, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ki-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICON...
- Publication number 20160157353
- Publication date Jun 2, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ryul CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING...
- Publication number 20150003020
- Publication date Jan 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Chang HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICON...
- Publication number 20140300001
- Publication date Oct 9, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRIP
- Publication number 20140240949
- Publication date Aug 28, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joong Sun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-EMBEDDED PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING...
- Publication number 20140159222
- Publication date Jun 12, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Suk Chang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140028336
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sang Yoon LEE
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120103671
- Publication date May 3, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Suek LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110266671
- Publication date Nov 3, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Seop Youm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRIP AND PANEL
- Publication number 20110048784
- Publication date Mar 3, 2011
- Samsung Electro-Mechanics CO., LTD.
- Ki-Gon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOL...
- Publication number 20100288535
- Publication date Nov 18, 2010
- Suk Chang HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Strip format of package board and array of the same
- Publication number 20070241438
- Publication date Oct 18, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyeog Kang
- H01 - BASIC ELECTRIC ELEMENTS

Kwang Seop Youm

Person

Patents Grantslast 30 patents

Printed circuit board and manufacturing method thereof, and semicon...

Chip-embedded printed circuit board and semiconductor package using...

Substrate strip

Printed circuit board strip and panel

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICON...

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICON...

SUBSTRATE STRIP

CHIP-EMBEDDED PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD STRIP AND PANEL

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOL...

Strip format of package board and array of the same