Kwang-Soo Kim

Person

Sunnyvale, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
- Publication number 20240332141
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER
- Publication number 20240258245
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT
- Publication number 20240250075
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...
- Publication number 20240170359
- Publication date May 23, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME
- Publication number 20240128246
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS
- Publication number 20240071892
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
- Publication number 20240038619
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE INTEGRATED CIRCUIT PACKAGE
- Publication number 20230378022
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG
- Publication number 20230245942
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH FIELD EFFECT TRANSISTOR
- Publication number 20230238350
- Publication date Jul 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS

Kwang-Soo Kim

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY

MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN...

SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

MOLDED PACKAGE WITH PRESS-FIT CONDUCTIVE PINS

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

POWER MODULE INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL HEAT SLUG

IC PACKAGE WITH FIELD EFFECT TRANSISTOR