Kwang-su Moon

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Armrest tilting device
- Patent number 12,128,803
- Issue date Oct 29, 2024
- Das Co., Ltd.
- Seong Hun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual release actuator for vehicle seat
- Patent number 12,005,816
- Issue date Jun 11, 2024
- Das Co., Ltd.
- Sung Won Kang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 11,804,472
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hak-Seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through silicon via and methods of ma...
- Patent number 11,600,552
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Ju-Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,488,860
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Su-jeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer planarization and an image sensor made by the same
- Patent number 11,417,536
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Joo Hee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonded by bonding pads
- Patent number 11,133,277
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Jin Nam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and methods of manufacturing the same
- Patent number 11,069,597
- Issue date Jul 20, 2021
- Samsung Electronics Co., Ltd.
- Dae-Suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through silicon via and methods of ma...
- Patent number 11,043,445
- Issue date Jun 22, 2021
- Samsung Electronics Co., Ltd.
- Ju-Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,978,655
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 10,950,578
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Hak-Seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus for directly bonding wafers and a wafer bon...
- Patent number 10,906,283
- Issue date Feb 2, 2021
- Samsung Electronics Co., Ltd.
- Tae-Yeong Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,032
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating substrate structure and substrate structure...
- Patent number 10,770,447
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Ho Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 10,763,163
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Su-jeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
- Patent number 10,639,875
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same...
- Patent number 10,580,726
- Issue date Mar 3, 2020
- Samsung Electronics Co., Ltd.
- Jin-Ho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure
- Patent number 10,468,400
- Issue date Nov 5, 2019
- Samsung Electronics Co., Ltd.
- Pil Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,446,774
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 10,325,869
- Issue date Jun 18, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating substrate structure and substrate structure...
- Patent number 10,325,897
- Issue date Jun 18, 2019
- Samsung Electronics Co., Ltd.
- Ho Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-to-wafer bonding structure
- Patent number 9,941,243
- Issue date Apr 10, 2018
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,831,164
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kwang-Jin Moon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING MEMORY DEVICE
- Publication number 20240338313
- Publication date Oct 10, 2024
- ESSENCORE Limited
- Chan Ho SOHN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006362
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL RELEASE ACTUATOR FOR VEHICLE SEAT
- Publication number 20230406160
- Publication date Dec 21, 2023
- DAS CO., LTD.
- Sung Won KANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
ACTUATOR FOR AUTOMOTIVE POWER SEAT SHARING BLDC MOTOR
- Publication number 20230373354
- Publication date Nov 23, 2023
- DAS CO., LTD.
- Sung Won KANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
ARMREST TILTING DEVICE
- Publication number 20230356637
- Publication date Nov 9, 2023
- DAS CO., LTD.
- Seong Hun Kim
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230282528
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060360
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220384311
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Seung Ha Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220367364
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- HYUNG JUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF...
- Publication number 20210375725
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Ju-ll CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH SILICON VIA AND METHODS OF M...
- Publication number 20210296211
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- Ju-Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20210272918
- Publication date Sep 2, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20210183822
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Hak-seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200357690
- Publication date Nov 12, 2020
- Samsung Electronics Co., Ltd.
- Su-jeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING BONDING PADS
- Publication number 20200243466
- Publication date Jul 30, 2020
- Samsung Electronics Co., Ltd.
- Jin Nam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER PLANARIZATION AND AN IMAGE SENSOR MADE BY THE SAME
- Publication number 20200168471
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- JOO HEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20200161277
- Publication date May 21, 2020
- Samsung Electronics Co., Ltd.
- Hak-seung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH SILICON VIA AND METHODS OF MA...
- Publication number 20200144158
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Ju-Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200075458
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Dae-suk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS FOR DIRECTLY BONDING WAFERS AND A WAFER BON...
- Publication number 20200055296
- Publication date Feb 20, 2020
- SAMSUNG ELECTRONICS., LTD.
- Tae-Yeong KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200027784
- Publication date Jan 23, 2020
- Samsung Electronics Co., Ltd.
- Su-jeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200006269
- Publication date Jan 2, 2020
- Samsung Electronics Co., Ltd.
- Yi-Koan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20190259718
- Publication date Aug 22, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...
- Publication number 20190259744
- Publication date Aug 22, 2019
- Samsung Electronics Co., Ltd.
- Ho Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME...
- Publication number 20190131228
- Publication date May 2, 2019
- Samsung Electronics Co., Ltd.
- Jin-Ho CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190067228
- Publication date Feb 28, 2019
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20190027450
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM INCLUDING THE SAME
- Publication number 20180370210
- Publication date Dec 27, 2018
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS

Kwang-su Moon

Person

Patents Grantslast 30 patents

Method for processing memory device

Semiconductor package and method of fabricating the same

Armrest tilting device

Semiconductor devices including through-silicon-vias and methods of...

Dual release actuator for vehicle seat

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor device having a through silicon via and methods of ma...

Integrated circuit device and method of manufacturing the same

Semiconductor device

Method for wafer planarization and an image sensor made by the same

Semiconductor device bonded by bonding pads

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor chips and methods of manufacturing the same

Semiconductor device having a through silicon via and methods of ma...

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor devices

Semiconductor device, semiconductor package and method of manufactu...

Wafer bonding apparatus for directly bonding wafers and a wafer bon...

Semiconductor device

Method for fabricating substrate structure and substrate structure...

Integrated circuit device and method of manufacturing the same

Wafer bonding apparatus and wafer bonding system including the same

Semiconductor devices and semiconductor packages including the same...

Method of manufacturing substrate structure

Semiconductor devices

Semiconductor devices, semiconductor packages, and methods of manuf...

Method for fabricating substrate structure and substrate structure...

Wafer-to-wafer bonding structure

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

METHOD FOR PROCESSING MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

DUAL RELEASE ACTUATOR FOR VEHICLE SEAT

ACTUATOR FOR AUTOMOTIVE POWER SEAT SHARING BLDC MOTOR

ARMREST TILTING DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF...

SEMICONDUCTOR DEVICE HAVING A THROUGH SILICON VIA AND METHODS OF M...

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING BONDING PADS

METHOD FOR WAFER PLANARIZATION AND AN IMAGE SENSOR MADE BY THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE HAVING A THROUGH SILICON VIA AND METHODS OF MA...

SEMICONDUCTOR CHIPS AND METHODS OF MANUFACTURING THE SAME

WAFER BONDING APPARATUS FOR DIRECTLY BONDING WAFERS AND A WAFER BON...

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

WAFER BONDING APPARATUS AND WAFER BONDING SYSTEM INCLUDING THE SAME