Kwang-Su Yu

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Test socket for testing electrical characteristics of a memory module
- Patent number 8,616,907
- Issue date Dec 31, 2013
- Samsung Electronics Co., Ltd.
- Jung-Hoon Kim
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board for memory module, method of manufacturing th...
- Patent number 8,189,342
- Issue date May 29, 2012
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board of semiconductor package and method for mount...
- Patent number 7,576,437
- Issue date Aug 18, 2009
- Samsung Electronic Co., Ltd.
- Seong-Chan Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with conductive element between chip packages
- Patent number 7,521,788
- Issue date Apr 21, 2009
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Open socket
- Patent number 7,061,768
- Issue date Jun 13, 2006
- Samsung Electronics Co., Ltd.
- Dong-Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Test Socket for Testing Electrical Characteristics of a Memory Module
- Publication number 20120007625
- Publication date Jan 12, 2012
- Jung-Hoon Kim
- G01 - MEASURING TESTING
Information Patent Application
PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND...
- Publication number 20110079872
- Publication date Apr 7, 2011
- Samsung Electronics Co., Ltd.
- Seong-Chan HAN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board including reinforced copper plated film and m...
- Publication number 20070181993
- Publication date Aug 9, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Hoon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining method, method of mounting semiconductor package using the...
- Publication number 20070172690
- Publication date Jul 26, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Si-suk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board of semiconductor package and method for mount...
- Publication number 20070109758
- Publication date May 17, 2007
- Samsung Electronics Co. Ltd.
- Seong-Chan Han
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board for memory module, method of manufacturing th...
- Publication number 20070047377
- Publication date Mar 1, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module and method of manufacturing the same
- Publication number 20060102997
- Publication date May 18, 2006
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having heat sink
- Publication number 20060043578
- Publication date Mar 2, 2006
- Hyo-Jae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open socket
- Publication number 20050118878
- Publication date Jun 2, 2005
- Dong-Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Kwang-Su Yu

Person

Patents Grantslast 30 patents

Test socket for testing electrical characteristics of a memory module

Printed circuit board for memory module, method of manufacturing th...

Printed circuit board of semiconductor package and method for mount...

Semiconductor module with conductive element between chip packages

Open socket

Patents Applicationslast 30 patents

Test Socket for Testing Electrical Characteristics of a Memory Module

PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND...

Printed circuit board including reinforced copper plated film and m...

Joining method, method of mounting semiconductor package using the...

Printed circuit board of semiconductor package and method for mount...

Printed circuit board for memory module, method of manufacturing th...

Semiconductor module and method of manufacturing the same

Semiconductor device having heat sink

Open socket