Kwang Sup So

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Plating structure for wafer level packages
- Patent number 9,070,675
- Issue date Jun 30, 2015
- Amkor Technology, Inc.
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plating Structure For Wafer Level Packages
- Publication number 20140070408
- Publication date Mar 13, 2014
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS