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Kwang Yeun Won

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  • Suwon-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230260709
    • Publication date Aug 17, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Yoo Jeong LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230260708
    • Publication date Aug 17, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • So Jung AN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230238182
    • Publication date Jul 27, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyung Jong Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230230770
    • Publication date Jul 20, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • So Jung AN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230223195
    • Publication date Jul 13, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyung Jong Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230215646
    • Publication date Jul 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwang Yeun WON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230215643
    • Publication date Jul 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Chung Yeol Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230215647
    • Publication date Jul 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Yoo Jeong Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230162920
    • Publication date May 25, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyung Jong CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220199328
    • Publication date Jun 23, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyung Jong Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220199331
    • Publication date Jun 23, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Kong Joo Jeon
    • H01 - BASIC ELECTRIC ELEMENTS