Kwangjin Moon

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including through via structure
- Patent number 12,046,538
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-electrodes
- Patent number 11,961,788
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device including through silicon via
- Patent number 11,955,408
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Sohye Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,775
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,957
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,887,966
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages stacked by wafer bonding process and methods...
- Patent number 11,810,900
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,419
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for etching substrate bevel and semiconductor fabrication...
- Patent number 11,791,137
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,791,211
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through via structure
- Patent number 11,749,586
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,749,587
- Issue date Sep 5, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including penetratio...
- Patent number 11,728,245
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,721,628
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,694,980
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having penetration vias with portions having...
- Patent number 11,664,316
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through substrate vias and method of...
- Patent number 11,600,553
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Myungjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,782
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,607
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including through holes and methods of fabri...
- Patent number 11,373,932
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Hyoukyung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,362,067
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Kyuha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including bonding layer and adsorption layer
- Patent number 11,348,892
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,342,221
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack and method for manufacturing the same
- Patent number 11,315,894
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through vias and methods of fabrica...
- Patent number 11,295,981
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,133,240
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through substrate vias and method of...
- Patent number 11,101,196
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Myungjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,004,814
- Issue date May 11, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DE...
- Publication number 20240312935
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Joo Hee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES
- Publication number 20240274509
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Hyoukyung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243102
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240234377
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234251
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240153851
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240136334
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Jinnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...
- Publication number 20240071841
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sumin PARK
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240047305
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Seungha OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240038732
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240030083
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Yikoan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20230361004
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352410
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230335467
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS
- Publication number 20230260916
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Hakseung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253293
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Sohye CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230178533
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING CHAMBER
- Publication number 20230178345
- Publication date Jun 8, 2023
- Kyoungran Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108516
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...
- Publication number 20220406740
- Publication date Dec 22, 2022
- Samsung Electronics Co., Ltd.
- Taeyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES
- Publication number 20220399251
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Hyoukyung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND SEMICONDUCTOR...
- Publication number 20220367321
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220367320
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Hojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220359348
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336330
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Jinnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE
- Publication number 20220310485
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Sonkwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER
- Publication number 20220293549
- Publication date Sep 15, 2022
- SAMSUNG ELECATRONICS CO., LTD.
- Jaehyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220223555
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Hyungjun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...
- Publication number 20220199469
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- YI KOAN HONG
- H01 - BASIC ELECTRIC ELEMENTS

Kwangjin Moon

Person

Patents Grantslast 30 patents

Semiconductor device including through via structure

Semiconductor device including through-electrodes

Integrated circuit semiconductor device including through silicon via

Semiconductor device

Semiconductor device

Semiconductor packages

Method of manufacturing a semiconductor device including bonding la...

Semiconductor packages stacked by wafer bonding process and methods...

Semiconductor device

Apparatus for etching substrate bevel and semiconductor fabrication...

Semiconductor devices including through vias and methods of fabrica...

Semiconductor device including through via structure

Semiconductor device

Semiconductor device and semiconductor package including penetratio...

Semiconductor device

Semiconductor stack and method for manufacturing the same

Semiconductor devices having penetration vias with portions having...

Semiconductor device including through substrate vias and method of...

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor packages including through holes and methods of fabri...

Methods of manufacturing semiconductor devices

Semiconductor devices including bonding layer and adsorption layer

Semiconductor device

Semiconductor stack and method for manufacturing the same

Semiconductor devices including through vias and methods of fabrica...

Semiconductor device and semiconductor package

Semiconductor device including through substrate vias and method of...

Semiconductor device

Patents Applicationslast 30 patents

BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

LAYOUT METHOD OF SEMICONDUCTOR, INSPECTION METHOD OF WAFER, MANUFAC...

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES HAVING PENETRATION VIAS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF CLEANING CHAMBER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING BONDING ENHANCEMENT LAYER AND METHOD...

SEMICONDUCTOR DEVICE INCLUDING THROUGH-ELECTRODES

SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND SEMICONDUCTOR...

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIA STRUCTURE

SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER

SEMICONDUCTOR STACK AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES INCLUDING THROUGH VIAS AND METHODS OF FABRICA...