Kwangmo Chris Lim

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,594,512
- Issue date Feb 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with high-density interconnect layer having pilla...
- Patent number 11,532,584
- Issue date Dec 20, 2022
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,943,884
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with high-density interconnect layer having pilla...
- Patent number 10,872,872
- Issue date Dec 22, 2020
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,600,755
- Issue date Mar 24, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20210225802
- Publication date Jul 22, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH HIGH-DENSITY INTERCONNECT LAYER HAVING PILLA...
- Publication number 20210066232
- Publication date Mar 4, 2021
- Intel Corporation
- Robert Alan MAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20200227378
- Publication date Jul 16, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH HIGH-DENSITY INTERCONNECT LAYER HAVING PILLA...
- Publication number 20190363063
- Publication date Nov 28, 2019
- Intel Corporation
- Robert Alan MAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20190051629
- Publication date Feb 14, 2019
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS