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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package with open substrate and method of manufa...
Patent number
9,034,693
Issue date
May 19, 2015
ST Assembly Test Services Ltd.
Il Kwon Shim
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package with open substrate
Patent number
8,030,783
Issue date
Oct 4, 2011
ST Assembly Test Services Ltd.
Il Kwon Shim
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Integrated circuit package with open substrate
Patent number
7,626,277
Issue date
Dec 1, 2009
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip scale package with open substrate
Patent number
7,008,820
Issue date
Mar 7, 2006
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFA...
Publication number
20120018886
Publication date
Jan 26, 2012
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE
Publication number
20100038771
Publication date
Feb 18, 2010
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
Publication number
20060055009
Publication date
Mar 16, 2006
STATS ChipPAC Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP SCALE PACKAGE WITH OPEN SUBSTRATE
Publication number
20050277227
Publication date
Dec 15, 2005
ST ASSEMBLY TEST SERVICES LTD.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS