Kwei Chung Li

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip sub-assembly, methods of making same and device including...
- Patent number 7,125,746
- Issue date Oct 24, 2006
- MiniLogic Device Corporation Ltd.
- Kwei Chung Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip sub-assembly, methods of making same and device including...
- Patent number 6,831,355
- Issue date Dec 14, 2004
- MiniLogic Device Corporation Ltd.
- Kwei Chung Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Filp-chip sub-assembly, methods of making same and device including...
- Publication number 20050093126
- Publication date May 5, 2005
- MiniLogic Device Corporation Ltd.
- Kwei Chung Li
- H01 - BASIC ELECTRIC ELEMENTS