Kwo-Hau Wu

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of reducing thick film stress of spin-on dielectric and the...
- Patent number 6,903,029
- Issue date Jun 7, 2005
- National Science Council
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing thick film stress of spin-on dielectric and the...
- Patent number 6,774,461
- Issue date Aug 10, 2004
- National Science Council
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having structure of copper interconnect/barrie...
- Patent number 6,294,832
- Issue date Sep 25, 2001
- National Science Council
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sidewall capping for degradation-free damascene trenches...
- Patent number 6,251,753
- Issue date Jun 26, 2001
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...
- Publication number 20140264855
- Publication date Sep 18, 2014
- Macronix International Co., Ltd.
- Ming-Tung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing thick film stress of spin-on dielectric and the...
- Publication number 20040258932
- Publication date Dec 23, 2004
- National Science Council
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing thick film stress of spin-on dielectric and the...
- Publication number 20020142580
- Publication date Oct 3, 2002
- National Science Council
- Ching-Fa Yeh
- H01 - BASIC ELECTRIC ELEMENTS