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Kwok Cheung TSANG
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Irvine, CA, US
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last 30 patents
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Patent Grant
Flip chip pad geometry for an IC package substrate
Patent number
9,373,576
Issue date
Jun 21, 2016
Broadcom Corporation
Kwok Cheung Tsang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE
Publication number
20240203898
Publication date
Jun 20, 2024
Avago Technologies International Sales Pte. Limited
Jin Seong CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate with Differing Dielectric Constants
Publication number
20240145392
Publication date
May 2, 2024
Avago Technologies International Sales Pte. Limited
Dharmendra Saraswat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT PACKAGES AND FABRICATION METHODS USING BOND-ON-PAD (BOP) SU...
Publication number
20220367334
Publication date
Nov 17, 2022
Avago Technologies International Sales Pte. Limited
Wen-Hsien HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PAD GEOMETRY FOR AN IC PACKAGE SUBSTRATE
Publication number
20150194378
Publication date
Jul 9, 2015
BROADCOM CORPORATION
Kwok Cheung TSANG
H01 - BASIC ELECTRIC ELEMENTS