Kwok Kee Chung

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Automatic level adjustment for die bonder
- Patent number 8,293,043
- Issue date Oct 23, 2012
- ASM Assembly Automation LTD
- Kwok Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER
- Publication number 20080017293
- Publication date Jan 24, 2008
- Kwok Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS