Kwok Kee Chung

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Direct die attach utilizing heated bond head
- Patent number 7,854,365
- Issue date Dec 21, 2010
- ASM Assembly Automation LTD
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vision system for positioning a bonding tool
- Patent number 7,810,698
- Issue date Oct 12, 2010
- ASM Assembly Automation Ltd.
- Kwok Kee Chung
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
- Publication number 20120094440
- Publication date Apr 19, 2012
- Kwok Kee CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISION SYSTEM FOR POSITIONING A BONDING TOOL
- Publication number 20100125348
- Publication date May 20, 2010
- Kwok Kee CHUNG
- G05 - CONTROLLING REGULATING
Information Patent Application
DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
- Publication number 20100105172
- Publication date Apr 29, 2010
- Ming LI
- H01 - BASIC ELECTRIC ELEMENTS