Kwok Keung Szeto

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with substrate and method of ma...
- Patent number 10,109,587
- Issue date Oct 23, 2018
- STATS ChipPAC Pte. Ltd.
- Dao Nguyen Phu Cuong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with substrate and method of ma...
- Patent number 9,412,624
- Issue date Aug 9, 2016
- STATS ChipPAC Pte. Ltd.
- Dao Nguyen Phu Cuong
- H01 - BASIC ELECTRIC ELEMENTS