Kwok Wai WONG

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Control and monitoring system for thin die detachment and pick-up
- Patent number 8,092,645
- Issue date Jan 10, 2012
- ASM Assembly Automation LTD
- Siu Ping Yip
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20110192547
- Publication date Aug 11, 2011
- Siu Ping YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS