Kwok Yuen CHEUNG

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Kwai Chung, HK

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding tool and system
- Patent number 10,096,568
- Issue date Oct 9, 2018
- ASM Technology Singapore Pte. Ltd.
- Kwok Yuen Cheung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING TOOL AND SYSTEM
- Publication number 20160086830
- Publication date Mar 24, 2016
- Kwok Yuen CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND LINE THICKNESS CONTROL FOR DIE ATTACHMENT
- Publication number 20130011941
- Publication date Jan 10, 2013
- ASM Technology Singapore Pte, Ltd.
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS