Kwon-Young Roh

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package on package having plug-socket type wire conne...
- Patent number 7,652,367
- Issue date Jan 26, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Lae Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array package comprising a heat sink
- Patent number 6,521,990
- Issue date Feb 18, 2003
- Samsung Electronics Co., Ltd.
- Kwon-Young Roh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ON PACKAGE HAVING PLUG-SOCKET TYPE WIRE CONNE...
- Publication number 20080150116
- Publication date Jun 26, 2008
- Kyung-Lae JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING...
- Publication number 20080108169
- Publication date May 8, 2008
- Samsung Electronics Co., Ltd.
- Kwon-Young Roh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ultrathin module for semiconductor device and method of fabricating...
- Publication number 20060006511
- Publication date Jan 12, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Kwon-Young Roh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ball grid array package comprising a heat sink
- Publication number 20020084524
- Publication date Jul 4, 2002
- Samsung Electronics Co., Ltd.
- Kwon-Young Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame having a side ring pad and semiconductor chip package in...
- Publication number 20020024122
- Publication date Feb 28, 2002
- Samsung Electronics Co., Ltd.
- Young-Doo Jung
- H01 - BASIC ELECTRIC ELEMENTS