Kwong Hon Wong

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned contact combined with a replacement metal gate/high-K...
- Patent number 8,481,415
- Issue date Jul 9, 2013
- International Business Machines Corporation
- Jun Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for MOSFET gate electrode landing pad
- Patent number 8,304,912
- Issue date Nov 6, 2012
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified via bottom structure for reliability enhancement
- Patent number 7,906,428
- Issue date Mar 15, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,804,136
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature stable gate structure with metallic electrode
- Patent number 7,683,418
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a microelectromechanical system (MEMS) switch
- Patent number 7,657,995
- Issue date Feb 9, 2010
- International Business Machines Corporation
- Louis Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for MOSFET gate electrode landing pad
- Patent number 7,528,065
- Issue date May 5, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature stable gate structure with metallic electrode
- Patent number 7,521,345
- Issue date Apr 21, 2009
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,491,660
- Issue date Feb 17, 2009
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with encasing cap and methods of making the...
- Patent number 7,488,677
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,462,527
- Issue date Dec 9, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of fabricating a hinge type MEMS switch
- Patent number 7,348,870
- Issue date Mar 25, 2008
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified via bottom structure for reliability enhancement
- Patent number 7,282,802
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-temperature stable gate structure with metallic electrode
- Patent number 7,279,413
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layer for Pt on SiO2
- Patent number 7,270,884
- Issue date Sep 18, 2007
- Infineon Technologies AG
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low resistance and reliable via in inter-level di...
- Patent number 7,223,691
- Issue date May 29, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhanced uni-directional diffusion of metal and subseque...
- Patent number 7,208,414
- Issue date Apr 24, 2007
- International Business Machines Corporation
- Anthony G. Domenicucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistors of different materials
- Patent number 7,193,500
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate passive components using conductive polymer
- Patent number 7,112,502
- Issue date Sep 26, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with encasing cap and methods of making the...
- Patent number 7,105,445
- Issue date Sep 12, 2006
- International Business Machines Corporation
- Kwong-Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to generate porous organic dielectric
- Patent number 7,101,784
- Issue date Sep 5, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,087,997
- Issue date Aug 8, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System level device for battery and integrated circuit integration
- Patent number 7,088,074
- Issue date Aug 8, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Early detection of contact liner integrity by chemical reaction
- Patent number 7,078,247
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Lawrence Bauer, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional island pixel photo-sensor
- Patent number 7,041,525
- Issue date May 9, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated metal-insulator-metal capacitor and metal gate transistor
- Patent number 7,041,552
- Issue date May 9, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper to aluminum interlayer interconnect using stud and via liner
- Patent number 7,037,824
- Issue date May 2, 2006
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid electronic mask
- Patent number 7,023,528
- Issue date Apr 4, 2006
- International Business Machines Corporation
- Louis L. Hsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of fabrication of thin film resistor with 0 TCR
- Patent number 7,012,499
- Issue date Mar 14, 2006
- International Business Machines Corporation
- Jeffrey R. Amadon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared on-chip decoupling capacitor and heat-sink devices
- Patent number 6,967,416
- Issue date Nov 22, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-TEMPERATURE STABLE GATE STRUCTURE WITH METALLIC ELECTRODE
- Publication number 20090101993
- Publication date Apr 23, 2009
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH ENCASING CAP AND METHODS OF MAKING THE...
- Publication number 20080318415
- Publication date Dec 25, 2008
- International Business Machines Corporation
- Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT
- Publication number 20080220608
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Fabricate Passive Components Using Conductive Polymer
- Publication number 20080171418
- Publication date Jul 17, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Mosfet Gate Electrode Landing Pad
- Publication number 20080164525
- Publication date Jul 10, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20080045039
- Publication date Feb 21, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20080036007
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FABRICATING A HINGE TYPE MEMS SWITCH
- Publication number 20080014663
- Publication date Jan 17, 2008
- International Business Machines Corporation
- Louis Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT
- Publication number 20070281469
- Publication date Dec 6, 2007
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-TEMPERATURE STABLE GATE STRUCTURE WITH METALLIC ELECTRODE
- Publication number 20070262348
- Publication date Nov 15, 2007
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENHANCED UNI-DIRECTIONAL DIFFUSION OF METAL AND SUBSEQUE...
- Publication number 20070128867
- Publication date Jun 7, 2007
- International Business Machines Corporation
- Anthony G. Domenicucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEPOSITION & FORMATION OF METAL SILICIDES
- Publication number 20070087541
- Publication date Apr 19, 2007
- Kenneth John Giewont
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnect structures with encasing cap and methods of making the...
- Publication number 20070054489
- Publication date Mar 8, 2007
- International Business Machines Corporation
- Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20070007548
- Publication date Jan 11, 2007
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate passive components using conductive polymer
- Publication number 20060270098
- Publication date Nov 30, 2006
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures with encasing cap and methods of making the...
- Publication number 20060160349
- Publication date Jul 20, 2006
- International Business Machines Corporation
- Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FABRICATING A HINGE TYPE MEMS SWITCH
- Publication number 20060145792
- Publication date Jul 6, 2006
- International Business Machines Corporation
- Louis C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method of Intelligent Multistage System Deactivation
- Publication number 20060109117
- Publication date May 25, 2006
- International Business Machines Corporation
- Louis C. Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thin Film Resistors of Different Materials
- Publication number 20060087400
- Publication date Apr 27, 2006
- International Business Machines Corporation
- Anil K. Chinthakindi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modified via bottom structure for reliability enhancement
- Publication number 20060081986
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low resistance and reliable via in inter-level di...
- Publication number 20060084256
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ENHANCED UNI-DIRECTIONAL DIFFUSION OF COBA...
- Publication number 20060057844
- Publication date Mar 16, 2006
- International Business Machines Corporation
- Anthony G. Domenicucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated interconnection structures on integrated circuit chips
- Publication number 20060017169
- Publication date Jan 26, 2006
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High-temperature stable gate structure with metallic electrode
- Publication number 20050282341
- Publication date Dec 22, 2005
- International Business Machines Corporation
- Dae-Gyu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A LOW THERMAL BUDGET (MOL) LINER, A SEMICONDUCTOR DEVICE COMPRISING...
- Publication number 20050221612
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Laura Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to generate porous organic dielectric
- Publication number 20050200024
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a composite layer in addition to a barr...
- Publication number 20050067708
- Publication date Mar 31, 2005
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for deposition & formation of metal silicides
- Publication number 20050067745
- Publication date Mar 31, 2005
- Kenneth John Giewont
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE AND METHOD FOR METAL REPLACEMENT GATE OF HIGH PERFORMANCE
- Publication number 20050051854
- Publication date Mar 10, 2005
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EARLY DETECTION OF CONTACT LINER INTEGRITY BY CHEMICAL REACTION
- Publication number 20050010455
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Lawrence Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Kwong Hon Wong

Person

Patents Grantslast 30 patents

Self-aligned contact combined with a replacement metal gate/high-K...

Structure and method for MOSFET gate electrode landing pad

Modified via bottom structure for reliability enhancement

Method of forming nitride films with high compressive stress for im...

High-temperature stable gate structure with metallic electrode

Method of fabricating a microelectromechanical system (MEMS) switch

Structure and method for MOSFET gate electrode landing pad

High-temperature stable gate structure with metallic electrode

Method of forming nitride films with high compressive stress for im...

Interconnect structures with encasing cap and methods of making the...

Method of forming nitride films with high compressive stress for im...

Structure and method of fabricating a hinge type MEMS switch

Modified via bottom structure for reliability enhancement

High-temperature stable gate structure with metallic electrode

Adhesion layer for Pt on SiO2

Method of forming low resistance and reliable via in inter-level di...

Method for enhanced uni-directional diffusion of metal and subseque...

Thin film resistors of different materials

Method to fabricate passive components using conductive polymer

Interconnect structures with encasing cap and methods of making the...

Method to generate porous organic dielectric

Copper to aluminum interlayer interconnect using stud and via liner

System level device for battery and integrated circuit integration

Early detection of contact liner integrity by chemical reaction

Three-dimensional island pixel photo-sensor

Integrated metal-insulator-metal capacitor and metal gate transistor

Copper to aluminum interlayer interconnect using stud and via liner

Hybrid electronic mask

Method of fabrication of thin film resistor with 0 TCR

Shared on-chip decoupling capacitor and heat-sink devices

Patents Applicationslast 30 patents

HIGH-TEMPERATURE STABLE GATE STRUCTURE WITH METALLIC ELECTRODE

INTERCONNECT STRUCTURES WITH ENCASING CAP AND METHODS OF MAKING THE...

MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT

Method to Fabricate Passive Components Using Conductive Polymer

Structure and Method for Mosfet Gate Electrode Landing Pad

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...

STRUCTURE AND METHOD OF FABRICATING A HINGE TYPE MEMS SWITCH

MODIFIED VIA BOTTOM STRUCTURE FOR RELIABILITY ENHANCEMENT

HIGH-TEMPERATURE STABLE GATE STRUCTURE WITH METALLIC ELECTRODE

METHOD FOR ENHANCED UNI-DIRECTIONAL DIFFUSION OF METAL AND SUBSEQUE...

METHOD AND APPARATUS FOR DEPOSITION & FORMATION OF METAL SILICIDES

Interconnect structures with encasing cap and methods of making the...

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...

Method to fabricate passive components using conductive polymer

Interconnect structures with encasing cap and methods of making the...

STRUCTURE AND METHOD OF FABRICATING A HINGE TYPE MEMS SWITCH

Apparatus and Method of Intelligent Multistage System Deactivation

Thin Film Resistors of Different Materials

Modified via bottom structure for reliability enhancement

Method of forming low resistance and reliable via in inter-level di...

STRUCTURE AND METHOD FOR ENHANCED UNI-DIRECTIONAL DIFFUSION OF COBA...

Electroplated interconnection structures on integrated circuit chips

High-temperature stable gate structure with metallic electrode

A LOW THERMAL BUDGET (MOL) LINER, A SEMICONDUCTOR DEVICE COMPRISING...

Method to generate porous organic dielectric

Semiconductor device having a composite layer in addition to a barr...

Method and apparatus for deposition & formation of metal silicides

STRUCTURE AND METHOD FOR METAL REPLACEMENT GATE OF HIGH PERFORMANCE

EARLY DETECTION OF CONTACT LINER INTEGRITY BY CHEMICAL REACTION