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Ky-Hyun Jung
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Cheonan-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming at least one bonding structure
Patent number
8,053,351
Issue date
Nov 8, 2011
Samsung Electronics Co., Ltd.
Hwang-Bok Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and method thereof and a solder ball land and...
Patent number
8,039,972
Issue date
Oct 18, 2011
Samsung Electronics Co., Ltd.
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and method thereof and a solder ball land and...
Patent number
7,576,438
Issue date
Aug 18, 2009
Samsung Electronics Co., Ltd.
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
WAVE SOLDERING APPARATUS TO APPLY BUOYANCY, SOLDERING METHOD, AND M...
Publication number
20110293903
Publication date
Dec 1, 2011
Samsung Electronics Co., Ltd.
Ky-hyun JUNG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE
Publication number
20110136334
Publication date
Jun 9, 2011
Samsung Electronics Co., Ltd.
Hwang-Bok Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Printed circuit board and method thereof and a solder ball land and...
Publication number
20090278249
Publication date
Nov 12, 2009
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
Publication number
20090200362
Publication date
Aug 13, 2009
Ky-Hyun JUNG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cleaning solutions and methods of cleaning boards using the same
Publication number
20080110477
Publication date
May 15, 2008
Samsung Electronics Co., Ltd.
Ky-Hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
Publication number
20080061434
Publication date
Mar 13, 2008
Samsung Electronics Co., Ltd.
Ky-Hyun JUNG
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Printed circuit board and method thereof and a solder ball land and...
Publication number
20070040282
Publication date
Feb 22, 2007
SAMSUNG ELECTRONICS CO., LTD.
Ky-hyun Jung
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR