Kyeong Rok SHIN

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Gwangju, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising first molding layer and second mol...
- Patent number 12,198,997
- Issue date Jan 14, 2025
- Nepes Co., Ltd.
- Su Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210398869
- Publication date Dec 23, 2021
- NEPES CO., LTD.
- Su Yun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210343656
- Publication date Nov 4, 2021
- NEPES CO., LTD.
- Yong Tae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200273830
- Publication date Aug 27, 2020
- NEPES CO., LTD.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS