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Kyeongbin LIM
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Yongin-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
Patent number
11,837,573
Issue date
Dec 5, 2023
Samsung Electronics Co., Ltd.
Junhyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
11,581,188
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Junhyung Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer to wafer bonding apparatuses
Patent number
11,443,965
Issue date
Sep 13, 2022
Samsung Electronics Co., Ltd.
Kyeongbin Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE BONDING METHOD
Publication number
20240145416
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Wonyoung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-CONTACT TYPE GRIPPER
Publication number
20240139972
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Daeho Min
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
DIE ALIGNMENT METHOD USING MAGNETIC FORCE
Publication number
20230178280
Publication date
Jun 8, 2023
Samsung Electronics Co., Ltd.
Sumin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSFER APPARATUS
Publication number
20230113869
Publication date
Apr 13, 2023
SAMSUNG ELECTRONICS., LTD.
Juno Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20210398935
Publication date
Dec 23, 2021
Samsung Electronics Co., Ltd.
Junhyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AN...
Publication number
20210143030
Publication date
May 13, 2021
Samsung Electronics Co., Ltd.
Kyeongbin Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE BONDING APPARATUS
Publication number
20210104405
Publication date
Apr 8, 2021
KNU-INDUSTRY COOPERATION FOUNDATION
Junhyung Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
Publication number
20210005475
Publication date
Jan 7, 2021
Samsung Electronics Co., Ltd.
Kyeongbin LIM
H01 - BASIC ELECTRIC ELEMENTS