Kyeongbin LIM

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
- Patent number 11,837,573
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,581,188
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHUCK FOR WAFER BONDING DEVICE
- Publication number 20250219011
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Kyungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME
- Publication number 20250140588
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20250132185
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Jonghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250070079
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- YongChul SHIN
- B32 - LAYERED PRODUCTS
Information Patent Application
WARPAGE CONTROL
- Publication number 20250054878
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Sujie Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...
- Publication number 20240282604
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Sunwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240145416
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTACT TYPE GRIPPER
- Publication number 20240139972
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Daeho Min
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DIE ALIGNMENT METHOD USING MAGNETIC FORCE
- Publication number 20230178280
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sumin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER APPARATUS
- Publication number 20230113869
- Publication date Apr 13, 2023
- SAMSUNG ELECTRONICS., LTD.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210398935
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AN...
- Publication number 20210143030
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20210104405
- Publication date Apr 8, 2021
- KNU-INDUSTRY COOPERATION FOUNDATION
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS

Kyeongbin LIM

Person

Patents Grantslast 30 patents

Chip bonding apparatus and method of manufacturing semiconductor de...

Substrate bonding apparatus

Wafer to wafer bonding apparatuses

Patents Applicationslast 30 patents

CHUCK FOR WAFER BONDING DEVICE

DIE BONDING APPARATUS AND DIE BONDING METHOD USING THE SAME

COOLING SYSTEM FOR SEMICONDUCTOR EQUIPMENT

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

WARPAGE CONTROL

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMI...

DIE BONDING APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SUBSTRATE BONDING METHOD

NON-CONTACT TYPE GRIPPER

DIE ALIGNMENT METHOD USING MAGNETIC FORCE

SUBSTRATE TRANSFER APPARATUS

CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

WAFER TO WAFER BONDING APPARATUS, WAFER TO WAFER BONDING SYSTEM, AN...

SUBSTRATE BONDING APPARATUS

WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES