Kyle K. Kirby

Person

Eagle, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with vertically offset bondin...
- Patent number 11,942,444
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with through-substrate via cores
- Patent number 11,942,428
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 11,862,569
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with back-side coils for wireless signal and...
- Patent number 11,823,977
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front end of line interconnect structures and associated systems an...
- Patent number 11,817,305
- Issue date Nov 14, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination-bonded die pair packaging and associated systems and me...
- Patent number 11,776,926
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
- Patent number 11,769,738
- Issue date Sep 26, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stacks and associated systems and methods
- Patent number 11,735,568
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory stacks connected to processing units and assoc...
- Patent number 11,735,528
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- G11 - INFORMATION STORAGE
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,631,644
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,587,912
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with vertically offset bondin...
- Patent number 11,587,895
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height interconnect structures and associated systems and met...
- Patent number 11,569,203
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 11,532,578
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 11,527,436
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination-bonded die pair packaging and associated systems and me...
- Patent number 11,289,440
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stacks and associated systems and methods
- Patent number 11,239,207
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory stacks connected to processing units and assoc...
- Patent number 11,239,169
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wafer handling and processing
- Patent number 11,195,740
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for filling vias in microelectr...
- Patent number 11,177,175
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,088,114
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses exhibiting enhanced stress resistance and planarity, an...
- Patent number 11,056,443
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated solder TSV insertion interconnect
- Patent number 11,018,056
- Issue date May 25, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 10,998,271
- Issue date May 4, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-silicon vias and associated me...
- Patent number 10,978,386
- Issue date Apr 13, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DI solder cup
- Patent number 10,964,654
- Issue date Mar 30, 2021
- Micron Technology Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array and test ability
- Patent number 10,943,794
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with back-side coils for wireless signal and...
- Patent number 10,872,843
- Issue date Dec 22, 2020
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240136295
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20240087987
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071823
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...
- Publication number 20240071970
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
- Publication number 20240071987
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS
- Publication number 20240071989
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...
- Publication number 20240072004
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20240071969
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BO...
- Publication number 20240071986
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...
- Publication number 20230395516
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- G11 - INFORMATION STORAGE
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...
- Publication number 20230260964
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260875
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20230260876
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CONDUCTIVE CYLINDER IN A SEMICONDUCTOR DEVICE AND ASSOCI...
- Publication number 20230260877
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDABLE HEAT SINK FOR MULTIPLE DIE PACKAGING
- Publication number 20230238300
- Publication date Jul 27, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDIN...
- Publication number 20230197656
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20230197689
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-HEIGHT INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND MET...
- Publication number 20230170331
- Publication date Jun 1, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...
- Publication number 20230064032
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIA...
- Publication number 20230050652
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDIN...
- Publication number 20220344294
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20220336273
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...
- Publication number 20220246569
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...
- Publication number 20220157728
- Publication date May 19, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20220157783
- Publication date May 19, 2022
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS

Kyle K. Kirby

Person

Patents Grantslast 30 patents

Semiconductor with through-substrate interconnect

High density pillar interconnect conversion with stack to substrate...

Semiconductor interconnect structures with vertically offset bondin...

Inductors with through-substrate via cores

Front end of line interconnect structures and associated systems an...

Semiconductor devices with back-side coils for wireless signal and...

Front end of line interconnect structures and associated systems an...

Combination-bonded die pair packaging and associated systems and me...

Apparatuses exhibiting enhanced stress resistance and planarity, an...

Semiconductor die stacks and associated systems and methods

Semiconductor memory stacks connected to processing units and assoc...

High density pillar interconnect conversion with stack to substrate...

High density pillar interconnect conversion with stack to substrate...

Semiconductor interconnect structures with vertically offset bondin...

Multi-height interconnect structures and associated systems and met...

3DI solder cup

Microelectronic devices with through-substrate interconnects and as...

Combination-bonded die pair packaging and associated systems and me...

Semiconductor die stacks and associated systems and methods

Semiconductor memory stacks connected to processing units and assoc...

Methods and apparatus for wafer handling and processing

Microelectronic devices and methods for filling vias in microelectr...

High density pillar interconnect conversion with stack to substrate...

Apparatuses exhibiting enhanced stress resistance and planarity, an...

Encapsulated solder TSV insertion interconnect

High density pillar interconnect conversion with stack to substrate...

Microelectronic devices with through-silicon vias and associated me...

3DI solder cup

Semiconductor device assembly with pillar array and test ability

Semiconductor devices with back-side coils for wireless signal and...

Patents Applicationslast 30 patents

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

SEMICONDUCTOR DEVICE CIRCUITRY FORMED THROUGH VOLUMETRIC EXPANSION

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED IN...

EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...

SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS

SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...

SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS

PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BO...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...

MONOLITHIC CONDUCTIVE COLUMNS IN A SEMICONDUCTOR DEVICE AND ASSOCIA...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

MONOLITHIC CONDUCTIVE CYLINDER IN A SEMICONDUCTOR DEVICE AND ASSOCI...

GRINDABLE HEAT SINK FOR MULTIPLE DIE PACKAGING

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDIN...

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

MULTI-HEIGHT INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND MET...

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

EXOTHERMIC REACTIVE BONDING FOR SEMICONDUCTOR DIE ASSEMBLIES AND AS...

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIA...

SEMICONDUCTOR INTERCONNECT STRUCTURES WITH VERTICALLY OFFSET BONDIN...

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

COMBINATION-BONDED DIE PAIR PACKAGING AND ASSOCIATED SYSTEMS AND ME...

SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...

SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS