Kyle Ritter

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices including tiered stacks including conductiv...
- Patent number 11,903,196
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Grant
Integrated assemblies having conductive-shield-structures between l...
- Patent number 11,728,263
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive structures, and relate...
- Patent number 11,527,546
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses including air gaps between conductiv...
- Patent number 11,456,208
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive-shield-structures between l...
- Patent number 11,302,628
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization topography control via implant
- Patent number 9,401,285
- Issue date Jul 26, 2016
- Micron Technology, Inc.
- Andrew Carswell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORT STRUCTURES FOR TIER DEFLECTION IN A MEMORY SYSTEM
- Publication number 20240357809
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Zeyar Lin Aung
Information Patent Application
MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20240099007
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES
- Publication number 20220415917
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...
- Publication number 20220384242
- Publication date Dec 1, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220238546
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING TIERED STACKS INCLUDING CONDUCTIV...
- Publication number 20220199641
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive-Shield-Structures Between L...
- Publication number 20220181254
- Publication date Jun 9, 2022
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING APPARATUSES INCLUDING AIR GAPS BETWEEN CONDUCTIV...
- Publication number 20220051930
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...
- Publication number 20220037350
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Conductive-Shield-Structures Between L...
- Publication number 20220013450
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Naveen Kaushik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION TOPOGRAPHY CONTROL VIA IMPLANT
- Publication number 20160172208
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Andrew Carswell
- H01 - BASIC ELECTRIC ELEMENTS

Kyle Ritter

Person

Patents Grantslast 30 patents

Microelectronic devices including tiered stacks including conductiv...

Integrated assemblies having conductive-shield-structures between l...

Microelectronic devices including conductive structures, and relate...

Methods of forming apparatuses including air gaps between conductiv...

Integrated assemblies having conductive-shield-structures between l...

Chemical mechanical planarization topography control via implant

Patents Applicationslast 30 patents

SUPPORT STRUCTURES FOR TIER DEFLECTION IN A MEMORY SYSTEM

MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES

APPARATUSES AND MEMORY DEVICES INCLUDING AIR GAPS BETWEEN CONDUCTIV...

Integrated Assemblies and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES INCLUDING TIERED STACKS INCLUDING CONDUCTIV...

Integrated Assemblies Having Conductive-Shield-Structures Between L...

METHODS OF FORMING APPARATUSES INCLUDING AIR GAPS BETWEEN CONDUCTIV...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...

Integrated Assemblies Having Conductive-Shield-Structures Between L...

CHEMICAL MECHANICAL PLANARIZATION TOPOGRAPHY CONTROL VIA IMPLANT