Kyle Whitten

Person

Hamden, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Compositions and methods for the electrodeposition of nanotwinned c...
- Patent number 11,873,568
- Issue date Jan 16, 2024
- MacDermid Enthone Inc.
- Kyle M. Whitten
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Cobalt chemistry for smooth topology
- Patent number 11,807,951
- Issue date Nov 7, 2023
- MacDermid Enthone Inc.
- Shaopeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,697,884
- Issue date Jul 11, 2023
- MacDermid Enthone Inc.
- Thomas Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 11,434,578
- Issue date Sep 6, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,401,618
- Issue date Aug 2, 2022
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Compositions and methods for the electrodeposition of nanotwinned c...
- Patent number 11,384,446
- Issue date Jul 12, 2022
- MacDermid Enthone Inc.
- Kyle M. Whitten
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Cobalt chemistry for smooth topology
- Patent number 11,230,778
- Issue date Jan 25, 2022
- MacDermid Enthone Inc.
- Shaopeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 11,168,406
- Issue date Nov 9, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper deposition in wafer level packaging of integrated circuits
- Patent number 11,124,888
- Issue date Sep 21, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Cobalt filling of interconnects
- Patent number 11,035,048
- Issue date Jun 15, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cobalt filling of interconnects in microelectronics
- Patent number 10,995,417
- Issue date May 4, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leveler compositions for use in copper deposition in manufacture of...
- Patent number 10,519,557
- Issue date Dec 31, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Levelers for copper deposition in microelectronics
- Patent number 10,294,574
- Issue date May 21, 2019
- MacDermid Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...
- Publication number 20240318342
- Publication date Sep 26, 2024
- MacDermid Enthone Inc.
- Jianwen Han
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Compositions and Methods for the Electrodeposition of Nanotwinned C...
- Publication number 20240110306
- Publication date Apr 4, 2024
- MacDermid Enthone Inc.
- Kyle M. Whitten
- B82 - NANO-TECHNOLOGY
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20240018678
- Publication date Jan 18, 2024
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Compositions and Methods for the Electrodeposition of Nanotwinned C...
- Publication number 20220298665
- Publication date Sep 22, 2022
- MacDermid Enthone Inc.
- Kyle M. Whitten
- B82 - NANO-TECHNOLOGY
Information Patent Application
COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
- Publication number 20220136123
- Publication date May 5, 2022
- MacDermid Enthone Inc.
- Shaopeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composition and Method for Fabrication of Nickel Interconnects
- Publication number 20220064811
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Compositions and Methods for the Electrodeposition of Nanotwinned C...
- Publication number 20220064812
- Publication date Mar 3, 2022
- MacDermid Enthone Inc.
- Kyle M. Whitten
- B82 - NANO-TECHNOLOGY
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20210388519
- Publication date Dec 16, 2021
- MacDermid Enthone Inc.
- Thomas Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20210332491
- Publication date Oct 28, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20210310141
- Publication date Oct 7, 2021
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20210222314
- Publication date Jul 22, 2021
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COBALT CHEMISTRY FOR SMOOTH TOPOLOGY
- Publication number 20210180200
- Publication date Jun 17, 2021
- MacDermid Enthone Inc.
- Shaopeng Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for use in Copper Deposition in Manufacture of...
- Publication number 20200063280
- Publication date Feb 27, 2020
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cobalt Filling of Interconnects in Microelectronics
- Publication number 20200040478
- Publication date Feb 6, 2020
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Electrodeposition in Microelectronics
- Publication number 20190390356
- Publication date Dec 26, 2019
- MacDermid Enthone Inc.
- Vincent Paneccasio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Deposition in Wafer Level Packaging of Integrated Circuits
- Publication number 20190368064
- Publication date Dec 5, 2019
- MacDermid Enthone Inc.
- Thomas Richardson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cobalt Filling of Interconnects
- Publication number 20190010624
- Publication date Jan 10, 2019
- MacDermid Enthone Inc.
- John Commander
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Leveler Compositions for Use in Copper Deposition in Manufacture of...
- Publication number 20170233883
- Publication date Aug 17, 2017
- MacDermid Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition of Copper
- Publication number 20160281251
- Publication date Sep 29, 2016
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS
- Publication number 20160076160
- Publication date Mar 17, 2016
- Enthone Inc.
- Kyle Whitten
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kyle Whitten

Person

Patents Grantslast 30 patents

Compositions and methods for the electrodeposition of nanotwinned c...

Cobalt chemistry for smooth topology

Copper deposition in wafer level packaging of integrated circuits

Cobalt filling of interconnects in microelectronics

Cobalt filling of interconnects

Compositions and methods for the electrodeposition of nanotwinned c...

Cobalt chemistry for smooth topology

Leveler compositions for use in copper deposition in manufacture of...

Copper deposition in wafer level packaging of integrated circuits

Cobalt filling of interconnects

Cobalt filling of interconnects in microelectronics

Leveler compositions for use in copper deposition in manufacture of...

Levelers for copper deposition in microelectronics

Patents Applicationslast 30 patents

COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...

Compositions and Methods for the Electrodeposition of Nanotwinned C...

Copper Electrodeposition in Microelectronics

Compositions and Methods for the Electrodeposition of Nanotwinned C...

COBALT CHEMISTRY FOR SMOOTH TOPOLOGY

Composition and Method for Fabrication of Nickel Interconnects

Compositions and Methods for the Electrodeposition of Nanotwinned C...

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

Leveler Compositions for use in Copper Deposition in Manufacture of...

Cobalt Filling of Interconnects in Microelectronics

COBALT CHEMISTRY FOR SMOOTH TOPOLOGY

Leveler Compositions for use in Copper Deposition in Manufacture of...

Cobalt Filling of Interconnects in Microelectronics

Copper Electrodeposition in Microelectronics

Copper Deposition in Wafer Level Packaging of Integrated Circuits

Cobalt Filling of Interconnects

Leveler Compositions for Use in Copper Deposition in Manufacture of...

Electrodeposition of Copper

LEVELERS FOR COPPER DEPOSITION IN MICROELECTRONICS