Kyle Yazzie

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mechanical failure monitoring, detection, and classification in ele...
- Patent number 11,327,050
- Issue date May 10, 2022
- Intel Corporation
- Kyle Yazzie
- G01 - MEASURING TESTING
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 11,322,455
- Issue date May 3, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling a magnet with a MEMS device
- Patent number 11,022,792
- Issue date Jun 1, 2021
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with cathodic protection for corrosion mitigation
- Patent number 10,998,275
- Issue date May 4, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes lamination layer
- Patent number 10,985,080
- Issue date Apr 20, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with patterned protective material
- Patent number 10,957,656
- Issue date Mar 23, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Constrained cure component attach process for improved IC package w...
- Patent number 10,290,569
- Issue date May 14, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of assembling an electronic component using a probe having a...
- Patent number 10,278,318
- Issue date Apr 30, 2019
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced fiducial visibility and recognition
- Patent number 10,049,987
- Issue date Aug 14, 2018
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum lamination of depth-sensing camera module PCB to stiffener u...
- Patent number 9,661,745
- Issue date May 23, 2017
- Intel Corporation
- Kyle Yazzie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ROBUST MOLD INTEGRATED SUBSTRATE
- Publication number 20220165686
- Publication date May 26, 2022
- Intel Corporation
- Jimin Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
- Publication number 20200357752
- Publication date Nov 12, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
- Publication number 20200066655
- Publication date Feb 27, 2020
- Intel Corporation
- Feras EID
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION
- Publication number 20200006256
- Publication date Jan 2, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A MAGNET WITH A MEMS DEVICE
- Publication number 20190391386
- Publication date Dec 26, 2019
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL FAILURE MONITORING, DETECTION, AND CLASSIFICATION IN ELE...
- Publication number 20190257793
- Publication date Aug 22, 2019
- Intel Corporation
- Kyle Yazzie
- G01 - MEASURING TESTING
Information Patent Application
ROBUST MOLD INTEGRATED SUBSTRATE
- Publication number 20190189567
- Publication date Jun 20, 2019
- Intel Corporation
- Jimin Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...
- Publication number 20190103345
- Publication date Apr 4, 2019
- Intel Corporation
- Kyle YAZZIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
- Publication number 20180350709
- Publication date Dec 6, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PICK AND PLACE PROBE
- Publication number 20180322993
- Publication date Nov 8, 2018
- Intel Corporation
- Kyle YAZZIE
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ENHANCED FIDUCIAL VISIBILITY AND RECOGNITION
- Publication number 20180182712
- Publication date Jun 28, 2018
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...
- Publication number 20170176516
- Publication date Jun 22, 2017
- Intel Corporation
- Mohit Mamodia
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...
- Publication number 20170181339
- Publication date Jun 22, 2017
- Intel Corporation
- Kyle Yazzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kyle Yazzie

Person

Patents Grantslast 30 patents

Mechanical failure monitoring, detection, and classification in ele...

Die back side structures for warpage control

Robust mold integrated substrate

Coupling a magnet with a MEMS device

Package with cathodic protection for corrosion mitigation

Electronic package that includes lamination layer

Integrated circuit packages with patterned protective material

Thermal head with a thermal barrier for integrated circuit die proc...

Constrained cure component attach process for improved IC package w...

Method of assembling an electronic component using a probe having a...

Enhanced fiducial visibility and recognition

Vacuum lamination of depth-sensing camera module PCB to stiffener u...

Patents Applicationslast 30 patents

ROBUST MOLD INTEGRATED SUBSTRATE

INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL

DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL

PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION

COUPLING A MAGNET WITH A MEMS DEVICE

MECHANICAL FAILURE MONITORING, DETECTION, AND CLASSIFICATION IN ELE...

ROBUST MOLD INTEGRATED SUBSTRATE

CONSTRAINED CURE COMPONENT ATTACH PROCESS FOR IMPROVED IC PACKAGE W...

ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER

MAGNETIC PICK AND PLACE PROBE

ENHANCED FIDUCIAL VISIBILITY AND RECOGNITION

Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...

ASSEMBLY PROBE UTLIZING A FLUID TO ASSEMBLE COMPONENTS AND SYSTEMS...