Kyohei KOUTAKE

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Kariya-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method, wafer polishing apparatus, and ingot slici...
- Patent number 8,758,087
- Issue date Jun 24, 2014
- Denso Corporation
- Kyohei Koutake
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
HIGH HARDNESS MATERIAL WORKING METHOD AND WORKING APPARATUS
- Publication number 20130217305
- Publication date Aug 22, 2013
- DENSO CORPORATION
- Kyohei KOUTAKE
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICI...
- Publication number 20110294403
- Publication date Dec 1, 2011
- DENSO CORPORATION
- Kyohei KOUTAKE
- B28 - WORKING CEMENT, CLAY, OR STONE