Kyoka Susuki

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Naka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS,...
- Publication number 20230038219
- Publication date Feb 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING COPPER OXIDE POWDER, AND COPPER OXIDE POWDER
- Publication number 20230027568
- Publication date Jan 26, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN-ALLOY PLATING LIQUID, BUMP FORMING METHOD, AND CIRCUIT B...
- Publication number 20210040636
- Publication date Feb 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378025
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378024
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR