KYOKO NISHIDONO

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip-encapsulating resin composition containing epoxy...
- Patent number 11,244,878
- Issue date Feb 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kyoko Nishidono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing epoxy resin composition, hardened product, and semiconducto...
- Patent number 9,633,922
- Issue date Apr 25, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuto Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...
- Publication number 20210183719
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyoko NISHIDONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING EPOXY RESIN COMPOSITION, HARDENED PRODUCT, AND SEMICONDUCTO...
- Publication number 20160260645
- Publication date Sep 8, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- KAZUTO OGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...