Kyol PARK

Person

Daejeon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and semiconductor device including the same
- Patent number 9,679,874
- Issue date Jun 13, 2017
- Samsung Electronics Co., Ltd.
- Jin-Kwon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and electronic system including the same
- Patent number 9,666,503
- Issue date May 30, 2017
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 9,583,430
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for predicting the temperature of a device
- Patent number 9,482,584
- Issue date Nov 1, 2016
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor packages including heat exhaust part
- Patent number 9,391,009
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including a surface...
- Patent number 9,293,389
- Issue date Mar 22, 2016
- Samsung Electronics Co., Ltd.
- Kyol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having a heat slug and a spacer
- Patent number 9,190,338
- Issue date Nov 17, 2015
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal dissipating member and method of...
- Patent number 9,054,067
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Yun-Hyoek Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 9,029,998
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,024,434
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat diffusion vias and interconne...
- Patent number 9,013,031
- Issue date Apr 21, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,921,990
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- Kyol Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages
- Patent number 8,587,134
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20160133605
- Publication date May 12, 2016
- Samsung Electronics Co., Ltd.
- Jin-Kwon BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE
- Publication number 20150115467
- Publication date Apr 30, 2015
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20150104905
- Publication date Apr 16, 2015
- Samsung Electronics Co., Ltd.
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART
- Publication number 20150054148
- Publication date Feb 26, 2015
- Eon-Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...
- Publication number 20140367860
- Publication date Dec 18, 2014
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SYSTEM-IN-PACKAGE STRUCTURE
- Publication number 20140353813
- Publication date Dec 4, 2014
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20140339708
- Publication date Nov 20, 2014
- Eon Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20140254092
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140217576
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Yun- Hyoek Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140168902
- Publication date Jun 19, 2014
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PREDICTING THE TEMPERATURE OF A DEVICE
- Publication number 20130259092
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20130134606
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120280382
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and semiconductor device including the same

Semiconductor package and electronic system including the same

Package-on-package device

System and method for predicting the temperature of a device

Semiconductor packages including heat exhaust part

Method of manufacturing a semiconductor package including a surface...

Semiconductor package having a heat slug and a spacer

Semiconductor package with thermal dissipating member and method of...

Semiconductor package device

Semiconductor packages

Semiconductor packages including heat diffusion vias and interconne...

Semiconductor package

Semiconductor packages

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

PACKAGE-ON-PACKAGE DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING HEAT EXHAUST PART

SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...

SEMICONDUCTOR PACKAGE HAVING A SYSTEM-IN-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SYSTEM AND METHOD FOR PREDICTING THE TEMPERATURE OF A DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES