Kyong Hwan Koh

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,132,007
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Jongwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of recesses and molding m...
- Patent number 12,057,357
- Issue date Aug 6, 2024
- Samsung Electronics Co, Ltd.
- Kyong Hwan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of fabricating the same
- Patent number 11,996,365
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of fabricating the same
- Patent number 11,610,845
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,581,266
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Jongwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of fabricating the same
- Patent number 11,107,769
- Issue date Aug 31, 2021
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347401
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178188
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Myung-Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20230223347
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- JONGHO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230170310
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068835
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220051957
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20210366832
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- JONGHO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20210035913
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- JONGHO PARK
- H01 - BASIC ELECTRIC ELEMENTS

Kyong Hwan Koh

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including plurality of recesses and molding m...

Semiconductor package and a method of fabricating the same

Semiconductor package and a method of fabricating the same

Semiconductor package

Semiconductor package and a method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME