Kyong Kuk Cho

Person

Gunpo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,664,330
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,978,409
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, semiconductor package including the printed...
- Patent number 10,672,694
- Issue date Jun 2, 2020
- Samsung Electronics Co., Ltd.
- Dong-suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,262,933
- Issue date Apr 16, 2019
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package
- Patent number 9,865,552
- Issue date Jan 9, 2018
- Samsung Electronics Co., Ltd.
- Han-Sung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,728,497
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Yu-duk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and device assembly including the same
- Patent number 9,305,990
- Issue date Apr 5, 2016
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- G02 - OPTICS
Information Patent Grant
Chip on film package and display device including the same
- Patent number 9,280,182
- Issue date Mar 8, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tape wiring substrate and chip-on-film package including the same
- Patent number 9,113,545
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- Sang-uk Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film (COF) substrate, COF package and display device includ...
- Patent number 9,059,162
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and tab package comprising the chip and...
- Patent number 8,952,510
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Operating method of CSG femto base station, handover method of hand...
- Patent number 8,880,074
- Issue date Nov 4, 2014
- Electronics and Telecommunications Research Institute
- Sang Chul Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of allotting carrier to station
- Patent number 8,848,567
- Issue date Sep 30, 2014
- Electronics and Telecommunications Research Institute
- Jun Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for controlling transmission power in femto base station and...
- Patent number 8,843,138
- Issue date Sep 23, 2014
- Electronics and Telecommunications Research Institute
- Kyong Tak Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method for identifying terminal located in space incl...
- Patent number 8,831,631
- Issue date Sep 9, 2014
- Electronics and Telecommunications Research Institute
- Kyong Tak Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 8,803,301
- Issue date Aug 12, 2014
- Samsung Electronics Co., Ltd.
- Kyong-soon Cho
- G02 - OPTICS
Information Patent Grant
Method of operating closed-mode base station and non-subscriber ter...
- Patent number 8,787,914
- Issue date Jul 22, 2014
- Electronics and Telecommunications Research Institute
- Jun Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wireless communication base station having dynamic cell structure
- Patent number 8,787,974
- Issue date Jul 22, 2014
- Electronics and Telecommunications Research Institute
- Jun Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor chip package
- Patent number 8,629,547
- Issue date Jan 14, 2014
- Samsung Electronics Co., Ltd.
- Kyong-Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and film and TAB package comprising the chip and...
- Patent number 8,575,735
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dynamic change of operation mode in wireless communicati...
- Patent number 8,538,406
- Issue date Sep 17, 2013
- Electronics and Telecommunications Research Institute
- Seung Que Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Remote controller supporting system and method for displaying funct...
- Patent number 8,429,537
- Issue date Apr 23, 2013
- Korea Advanced Institute of Science and Technology
- Jun Kyun Choi
- G08 - SIGNALLING
Information Patent Grant
Remote controller supporting system and method for handling event i...
- Patent number 8,413,057
- Issue date Apr 2, 2013
- Korea Advanced Institute of Science and Technology
- Jun Kyun Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Media mediator system and method for managing contents of various f...
- Patent number 8,346,741
- Issue date Jan 1, 2013
- Korea Advanced Institute of Science and Technology
- Jun Kyun Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for wireless multi-hop network
- Patent number 8,169,942
- Issue date May 1, 2012
- SNU R&DB Foundation
- Sae-Woong Bahk
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 7,915,727
- Issue date Mar 29, 2011
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic gain control feedback amplifier
- Patent number 7,157,977
- Issue date Jan 2, 2007
- Electronics and Telecommunications Research Institute
- Sang Heung Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Apparatus and method for generating PN states
- Patent number 7,082,448
- Issue date Jul 25, 2006
- LG Electronics Inc.
- Kyong Kuk Cho
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210225782
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190221513
- Publication date Jul 18, 2019
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190206807
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180337120
- Publication date Nov 22, 2018
- Samsung Electronics Co., Ltd.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED...
- Publication number 20170207155
- Publication date Jul 20, 2017
- Samsung Electronics Co., Ltd.
- Dong-suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170011992
- Publication date Jan 12, 2017
- Samsung Electronics Co., Ltd.
- Yu-duk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE
- Publication number 20160365319
- Publication date Dec 15, 2016
- Samsung Electronics Co., Ltd.
- Han-Sung RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20160162091
- Publication date Jun 9, 2016
- Samsung Electronics Co., Ltd.
- JEONG-KYU HA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME
- Publication number 20140300849
- Publication date Oct 9, 2014
- Samsung Electronics Co., Ltd.
- JAE-MIN JUNG
- G02 - OPTICS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140246687
- Publication date Sep 4, 2014
- Samsung Electronics Co., Ltd.
- Jeong-Kyu Ha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20140084430
- Publication date Mar 27, 2014
- Samsung Electronics Co., Ltd.
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Film (COF) Substrate, COF Package and Display Device Includ...
- Publication number 20140054793
- Publication date Feb 27, 2014
- Jeong-Kyu Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE LAYER FOR ELECTROSTATIC D...
- Publication number 20130240917
- Publication date Sep 19, 2013
- Samsung Electronics Co., Ltd.
- Kyong soon Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130234310
- Publication date Sep 12, 2013
- Samsung Electronics Co., Ltd.
- Han-Shin Youn
- G01 - MEASURING TESTING
Information Patent Application
REMOTE CONTROLLER SUPPORTING SYSTEM AND METHOD FOR DISPLAYING FUNCT...
- Publication number 20130227442
- Publication date Aug 29, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Kyun Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR TRANSMITTING SYSTEM INFORMATION OF LTE-BASED FEMTOCELL
- Publication number 20130210439
- Publication date Aug 15, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hyung Deug Bae
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REMOTE CONTROLLER SUPPORTING SYSTEM AND METHOD FOR HANDLING EVENT I...
- Publication number 20130194081
- Publication date Aug 1, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Kyun Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF ALLOTTING CARRIER TO STATION
- Publication number 20130148523
- Publication date Jun 13, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPERATING METHOD OF CSG FEMTO BASE STATION, HANDOVER METHOD OF HAND...
- Publication number 20130150042
- Publication date Jun 13, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Sang Chul OH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRELESS COMMUNICATION BASE STATION HAVING DYNAMIC CELL STRUCTURE
- Publication number 20130150127
- Publication date Jun 13, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME
- Publication number 20130148312
- Publication date Jun 13, 2013
- Sang-Uk Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEDIA MEDIATOR SYSTEM AND METHOD FOR MANAGING CONTENTS OF VARIOUS F...
- Publication number 20130103689
- Publication date Apr 25, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Kyun Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package
- Publication number 20120274868
- Publication date Nov 1, 2012
- Kyong-soon Cho
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD FOR IDENTIFYING TERMINAL LOCATED IN SPACE INCL...
- Publication number 20120244878
- Publication date Sep 27, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kyong Tak CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF OPERATING CLOSED-MODE BASE STATION AND NON-SUBSCRIBER TER...
- Publication number 20120165017
- Publication date Jun 28, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATION SYSTEM INCLUDING FEMTO BASE STATION
- Publication number 20120165027
- Publication date Jun 28, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jun Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR DYNAMIC CHANGE OF OPERATION MODE IN WIRELESS COMMUNICATI...
- Publication number 20120157077
- Publication date Jun 21, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Seung Que LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR CONTROLLING TRANSMISSION POWER IN FEMTO BASE STATION AND...
- Publication number 20120157154
- Publication date Jun 21, 2012
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kyong Tak CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE
- Publication number 20120074540
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- Kyong-Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...
- Publication number 20110210433
- Publication date Sep 1, 2011
- Young-Sang Cho
- H01 - BASIC ELECTRIC ELEMENTS

Kyong Kuk Cho

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Printed circuit board, semiconductor package including the printed...

Semiconductor package

Semiconductor package

Wafer level package

Semiconductor device and method of manufacturing the same

Chip-on-film package and device assembly including the same

Chip on film package and display device including the same

Tape wiring substrate and chip-on-film package including the same

Chip on film (COF) substrate, COF package and display device includ...

Semiconductor chip and film and tab package comprising the chip and...

Operating method of CSG femto base station, handover method of hand...

Method of allotting carrier to station

Method for controlling transmission power in femto base station and...

Apparatus and method for identifying terminal located in space incl...

Semiconductor package

Method of operating closed-mode base station and non-subscriber ter...

Wireless communication base station having dynamic cell structure

Semiconductor chip package

Semiconductor chip and film and TAB package comprising the chip and...

Method for dynamic change of operation mode in wireless communicati...

Remote controller supporting system and method for displaying funct...

Remote controller supporting system and method for handling event i...

Media mediator system and method for managing contents of various f...

Tape for heat dissipating member, chip on film type semiconductor p...

Method for wireless multi-hop network

Tape for heat dissipating member, chip on film type semiconductor p...

Automatic gain control feedback amplifier

Apparatus and method for generating PN states

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER LEVEL PACKAGE

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...

Chip on Film (COF) Substrate, COF Package and Display Device Includ...

SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE LAYER FOR ELECTROSTATIC D...

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

REMOTE CONTROLLER SUPPORTING SYSTEM AND METHOD FOR DISPLAYING FUNCT...

SYSTEM FOR TRANSMITTING SYSTEM INFORMATION OF LTE-BASED FEMTOCELL

REMOTE CONTROLLER SUPPORTING SYSTEM AND METHOD FOR HANDLING EVENT I...

METHOD OF ALLOTTING CARRIER TO STATION

OPERATING METHOD OF CSG FEMTO BASE STATION, HANDOVER METHOD OF HAND...

WIRELESS COMMUNICATION BASE STATION HAVING DYNAMIC CELL STRUCTURE

TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME

MEDIA MEDIATOR SYSTEM AND METHOD FOR MANAGING CONTENTS OF VARIOUS F...

Semiconductor Package

APPARATUS AND METHOD FOR IDENTIFYING TERMINAL LOCATED IN SPACE INCL...

METHOD OF OPERATING CLOSED-MODE BASE STATION AND NON-SUBSCRIBER TER...

COMMUNICATION SYSTEM INCLUDING FEMTO BASE STATION

METHOD FOR DYNAMIC CHANGE OF OPERATION MODE IN WIRELESS COMMUNICATI...

METHOD FOR CONTROLLING TRANSMISSION POWER IN FEMTO BASE STATION AND...

SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND...