Kyonghwan Koh

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Asan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor package and package-on-package
- Patent number 11,508,713
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
- Publication number 20230127641
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Seunghwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
- Publication number 20230114892
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE
- Publication number 20210242190
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS