KyongSoon CHO

Person

  • Incheon, KR

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

    • Publication number 20240213192
    • Publication date Jun 27, 2024
    • Samsung Electronics Co., Ltd.
    • KYONGSOON CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE

    • Publication number 20240006434
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • KYONGSOON CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE

    • Publication number 20230268370
    • Publication date Aug 24, 2023
    • Samsung Electronics Co., Ltd.
    • Kyongsoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES HAVING CIRCUIT BOARDS

    • Publication number 20230254975
    • Publication date Aug 10, 2023
    • Samsung Electronics Co., Ltd.
    • Sunjae KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20230154954
    • Publication date May 18, 2023
    • Samsung Electronics Co., Ltd.
    • Kyongsoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR

    • Publication number 20230027390
    • Publication date Jan 26, 2023
    • Samsung Electronics Co., Ltd.
    • Kyongsoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE

    • Publication number 20220139984
    • Publication date May 5, 2022
    • Samsung Electronics Co., Ltd.
    • Kyongsoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE

    • Publication number 20210193717
    • Publication date Jun 24, 2021
    • Samsung Electronics Co., Ltd.
    • Kyongsoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES

    • Publication number 20190287951
    • Publication date Sep 19, 2019
    • Samsung Electronics Co., Ltd.
    • JICHUL KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

    • Publication number 20180068958
    • Publication date Mar 8, 2018
    • Samsung Electronics Co., Ltd.
    • KyongSoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES

    • Publication number 20170207205
    • Publication date Jul 20, 2017
    • Jichul KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STRIP

    • Publication number 20160379937
    • Publication date Dec 29, 2016
    • Samsung Electronics Co., Ltd.
    • KyongSoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Methods of Fabricating Tape Film Packages

    • Publication number 20160111299
    • Publication date Apr 21, 2016
    • Jeong-Kyu HA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULES AND SEMICONDUCTOR PACKAGES

    • Publication number 20160044790
    • Publication date Feb 11, 2016
    • KyongSoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME

    • Publication number 20160020196
    • Publication date Jan 21, 2016
    • Jae-Min JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICES

    • Publication number 20140367659
    • Publication date Dec 18, 2014
    • Samsung Electronics Co., Ltd.
    • KyongSoon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE

    • Publication number 20140369009
    • Publication date Dec 18, 2014
    • Samsung Electronics Co., Ltd.
    • KyongSoon Cho
    • G02 - OPTICS
  • Information Patent Application

    DISPLAY APPARATUS

    • Publication number 20140328031
    • Publication date Nov 6, 2014
    • Samsung Electronics Co., Ltd.
    • KYOUNGSUK YANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP-ON-FILM PACKAGE AND DEVICE ASSEMBLY INCLUDING THE SAME

    • Publication number 20130293816
    • Publication date Nov 7, 2013
    • Samsung Electronics Co., Ltd.
    • Jae-Min JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Tape Film Packages and Methods of Fabricating the Same

    • Publication number 20130186680
    • Publication date Jul 25, 2013
    • Samsung Electronics Co., Ltd.
    • Jeong-Kyu Ha
    • H01 - BASIC ELECTRIC ELEMENTS