Kyosuke KOBINATA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing layered device chip assembly
- Patent number 12,322,655
- Issue date Jun 3, 2025
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE DEVICE MANUFACTURING METHOD
- Publication number 20230162990
- Publication date May 25, 2023
- Disco Corporation
- Kyosuke KOBINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY
- Publication number 20230096486
- Publication date Mar 30, 2023
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED DEVICE WAFER FORMING METHOD
- Publication number 20230020620
- Publication date Jan 19, 2023
- Disco Corporation
- Zhiwen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR