Kyoung-bok Cho

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for correcting a parallelism between a bonding head and a...
- Patent number 10,692,833
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball mounter
- Patent number 10,016,833
- Issue date Jul 10, 2018
- Samsung Electronics Co., Ltd.
- Seok-Yong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-line die attaching and curing apparatus for a multi-chip package
- Patent number 7,074,646
- Issue date Jul 11, 2006
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-line die attaching and curing apparatus for a multi-chip package
- Patent number 6,863,109
- Issue date Mar 8, 2005
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tablet detecting system for molding tablet supplying apparatus
- Patent number 6,782,677
- Issue date Aug 31, 2004
- Samsung Electronics Co., Ltd.
- Kyoung-Rae Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS
- Publication number 20180229329
- Publication date Aug 16, 2018
- Samsung Electronics Co., Ltd.
- MYUNG IL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...
- Publication number 20180102340
- Publication date Apr 12, 2018
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL MOUNTER
- Publication number 20150001278
- Publication date Jan 1, 2015
- Samsung Techwin Co., Ltd.
- SEOK-YONG LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR SEMICONDUCTOR DIE BONDING
- Publication number 20110079361
- Publication date Apr 7, 2011
- Byeong-kuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-line die attaching and curing apparatus for a multi-chip package
- Publication number 20050106778
- Publication date May 19, 2005
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-line die attaching and curing apparatus for a multi-chip package
- Publication number 20040108582
- Publication date Jun 10, 2004
- Samsung Electronics Co., Ltd.
- Hyun-Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tablet detecting system for molding tablet supplying apparatus
- Publication number 20030213215
- Publication date Nov 20, 2003
- Samsung Electronics Co.
- Kyoung-Rae Cho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS FOR CUTTING ADHESIVE TAPE MOUNTED ON SEMICONDUCTOR WAFER
- Publication number 20010002569
- Publication date Jun 7, 2001
- SUNG HO LEE
- H01 - BASIC ELECTRIC ELEMENTS

Kyoung-bok Cho

Person

Patents Grantslast 30 patents

Apparatus for correcting a parallelism between a bonding head and a...

Solder ball mounter

In-line die attaching and curing apparatus for a multi-chip package

In-line die attaching and curing apparatus for a multi-chip package

Tablet detecting system for molding tablet supplying apparatus

Patents Applicationslast 30 patents

BONDING APPARATUS

APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...

SOLDER BALL MOUNTER

APPARATUS FOR SEMICONDUCTOR DIE BONDING

In-line die attaching and curing apparatus for a multi-chip package

In-line die attaching and curing apparatus for a multi-chip package

Tablet detecting system for molding tablet supplying apparatus

APPARATUS FOR CUTTING ADHESIVE TAPE MOUNTED ON SEMICONDUCTOR WAFER