Kyoung Jin JUN

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated electronic component and circuit board for mounting the same
- Patent number 10,714,265
- Issue date Jul 14, 2020
- Hyundai Motor Company
- Soo Hwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having electronic component mounted...
- Patent number 10,448,502
- Issue date Oct 15, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer ceramic capacitor assembly
- Patent number 10,319,525
- Issue date Jun 11, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Soon-Ju Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,229,790
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,818,541
- Issue date Nov 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic component having metal frames connected to exter...
- Patent number 9,775,244
- Issue date Sep 26, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,697,953
- Issue date Jul 4, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same
- Patent number 9,520,233
- Issue date Dec 13, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Jin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 8,248,752
- Issue date Aug 21, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Kang Heon Hur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
- Publication number 20190172651
- Publication date Jun 6, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY
- Publication number 20180114646
- Publication date Apr 26, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Soon-Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...
- Publication number 20170105283
- Publication date Apr 13, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
- Publication number 20170011854
- Publication date Jan 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160217926
- Publication date Jul 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Jin JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY
- Publication number 20160217929
- Publication date Jul 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Soon-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160217928
- Publication date Jul 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160133386
- Publication date May 12, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160126013
- Publication date May 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160118190
- Publication date Apr 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160120027
- Publication date Apr 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20160086730
- Publication date Mar 24, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120147517
- Publication date Jun 14, 2012
- Samsung Electro-Mechanics CO., LTD.
- Kang Heon HUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20110157767
- Publication date Jun 30, 2011
- Samsung Electro-Mechanics CO., LTD.
- Kang Heon HUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20110141658
- Publication date Jun 16, 2011
- SAMSUNG ELECTRO-MECHANICS CO.,LTD.
- Eun Sang NA
- H01 - BASIC ELECTRIC ELEMENTS

Kyoung Jin JUN

Person

Patents Grantslast 30 patents

Laminated electronic component and circuit board for mounting the same

Electronic component and board having electronic component mounted...

Multi-layer ceramic capacitor assembly

Composite electronic component and board having the same

Multilayer ceramic electronic component and board having the same

Multilayer ceramic component having metal frames connected to exter...

Multilayer ceramic electronic component and board having the same

Electronic component and board having the same

Multilayer ceramic capacitor

Patents Applicationslast 30 patents

LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME

MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...

LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTI-LAYER CERAMIC CAPACITOR ASSEMBLY

MULTILAYER CERAMIC COMPONENT AND BOARD HAVING THE SAME

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR