Kyounglim SUK

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,068,302
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including under bump metallization pad
- Patent number 12,040,264
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including thermal exhaust pathway
- Patent number 12,009,274
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package including glass substrate and a plurality of r...
- Patent number 11,955,499
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,670,629
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029906
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyounglim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
- Publication number 20240347435
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240186231
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jihwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145396
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113001
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECT...
- Publication number 20240071894
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240065003
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047324
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230253392
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Seho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230071812
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jaegwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230049283
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD...
- Publication number 20220367403
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Seokhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD
- Publication number 20220328388
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220302002
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY
- Publication number 20220262699
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- EUNGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE INCLUDING GLASS SUBSTRATE
- Publication number 20220165778
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220037306
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Seho YOU
- H01 - BASIC ELECTRIC ELEMENTS

Kyounglim SUK

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including under bump metallization pad

Semiconductor package including thermal exhaust pathway

Image sensor package including glass substrate and a plurality of r...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGED INTEGRATED CIRCUIT HAVING ENHANCED ELECTRICAL INTERCONNECT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION SUBSTRATE AND METHOD...

SEMICONDUCTOR PACKAGE INCLUDING UNDER BUMP METALLIZATION PAD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY

IMAGE SENSOR PACKAGE INCLUDING GLASS SUBSTRATE

SEMICONDUCTOR PACKAGE