Kyoungran Kim

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate debonding apparatus
- Patent number 11,581,202
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and method for manufacturing sub...
- Patent number 9,640,507
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and substrate manufacturing equipment including t...
- Patent number 9,553,069
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR CHUCKING A WAFER
- Publication number 20240395594
- Publication date Nov 28, 2024
- PROTEC
- Hungsuk YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER DECHUCKING SYSTEM AND CARRIER DECHUCKING METHOD USING CARRI...
- Publication number 20240347370
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING CHAMBER
- Publication number 20230178345
- Publication date Jun 8, 2023
- Kyoungran Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING APPARATUS
- Publication number 20210358778
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...
- Publication number 20160118362
- Publication date Apr 28, 2016
- Samsung Electronics Co., Ltd.
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND METHOD FOR MANUFACTURING SUB...
- Publication number 20150053350
- Publication date Feb 26, 2015
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
- Publication number 20130139380
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS

Kyoungran Kim

Person

Patents Grantslast 30 patents

Substrate debonding apparatus

Bonding method, bonding apparatus, and method for manufacturing sub...

Bonding apparatus and substrate manufacturing equipment including t...

Patents Applicationslast 30 patents

APPARATUS FOR CHUCKING A WAFER

CARRIER DECHUCKING SYSTEM AND CARRIER DECHUCKING METHOD USING CARRI...

METHOD OF CLEANING CHAMBER

SUBSTRATE DEBONDING APPARATUS

BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...

BONDING METHOD, BONDING APPARATUS, AND METHOD FOR MANUFACTURING SUB...

CHIP BONDING APPARATUS

CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME