Kyoungsei CHOI

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 12,062,605
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packages
- Patent number 11,798,889
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 11,658,107
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and package on package having the same
- Patent number 11,581,263
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,482,554
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded semiconductor device
- Patent number 11,404,382
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an in interposer and method of fabr...
- Patent number 11,367,679
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interposer
- Patent number 11,367,688
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 10,868,073
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,825,776
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor package and stacked image sensor module includ...
- Patent number 10,756,055
- Issue date Aug 25, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor package and stacked image sensor module includ...
- Patent number 10,262,971
- Issue date Apr 16, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,211,159
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,177,188
- Issue date Jan 8, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,601,445
- Issue date Mar 21, 2017
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 9,425,156
- Issue date Aug 23, 2016
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices and methods of manufacturing the same
- Patent number 9,355,931
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,112,062
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,940,584
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 8,748,228
- Issue date Jun 10, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of controlling temperature thereof
- Patent number 8,692,349
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Tape wiring substrates and packages including the same
- Patent number 8,350,158
- Issue date Jan 8, 2013
- Samsung Electronics Co., Ltd.
- Yechung Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 8,198,722
- Issue date Jun 12, 2012
- Samsung Electronics Co., Ltd.
- Youngsang Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20220319973
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERPOSER
- Publication number 20220302035
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME
- Publication number 20210257305
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20210183757
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183777
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20210050297
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200303445
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR PACKAGE AND STACKED IMAGE SENSOR MODULE INCLUD...
- Publication number 20190206832
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20190139899
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20190074316
- Publication date Mar 7, 2019
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR PACKAGE AND STACKED IMAGE SENSOR MODULE INCLUD...
- Publication number 20180040584
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180040658
- Publication date Feb 8, 2018
- Samsung Electronics Co., Ltd.
- Un-Byoung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20160329285
- Publication date Nov 10, 2016
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages
- Publication number 20160148881
- Publication date May 26, 2016
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150206869
- Publication date Jul 23, 2015
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20150028477
- Publication date Jan 29, 2015
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20140239477
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF
- Publication number 20140184312
- Publication date Jul 3, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140117506
- Publication date May 1, 2014
- JiSun HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20130052775
- Publication date Feb 28, 2013
- Samsung Electronics Co., Ltd.
- Tongsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Controlling Temperature Thereof
- Publication number 20120133427
- Publication date May 31, 2012
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20100102432
- Publication date Apr 29, 2010
- Samsung Electronics Co., Ltd.
- YoungSang CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME
- Publication number 20100038117
- Publication date Feb 18, 2010
- Yechung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kyoungsei CHOI

Person

Patents Grantslast 30 patents

Semiconductor package including an interposer and method of fabrica...

Methods of manufacturing semiconductor packages

Semiconductor package including an interposer and method of fabrica...

Semiconductor package, and package on package having the same

Semiconductor package and method of fabricating the same

Semiconductor package including an embedded semiconductor device

Semiconductor package including an in interposer and method of fabr...

Semiconductor package with interposer

Method of fabricating semiconductor package

Semiconductor packages having semiconductor chips disposed in openi...

Stacked image sensor package and stacked image sensor module includ...

Stacked image sensor package and stacked image sensor module includ...

Semiconductor packages having semiconductor chips disposed in openi...

Semiconductor package and method of fabricating the same

Semiconductor packages

Semiconductor packages having semiconductor chips disposed in openi...

Package-on-package devices and methods of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor packages and methods of forming the same

Semiconductor packages and methods of forming the same

Semiconductor devices and methods of controlling temperature thereof

Tape wiring substrates and packages including the same

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE WITH INTERPOSER

SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

STACKED IMAGE SENSOR PACKAGE AND STACKED IMAGE SENSOR MODULE INCLUD...

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

STACKED IMAGE SENSOR PACKAGE AND STACKED IMAGE SENSOR MODULE INCLUD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

Semiconductor Packages

PACKAGE-ON-PACKAGE DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Devices And Methods Of Controlling Temperature Thereof

SEMICONDUCTOR PACKAGE

TAPE WIRING SUBSTRATES AND PACKAGES INCLUDING THE SAME